WMSIC Electronic Components

UNI-ROYAL 0201WMJ0303TEE

Model0201WMJ0303TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMJ0303TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMJ0303TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
30kΩ
Electronic Component
50
Electronic Component
BM0263575122
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMJ0303TEE 贴片厚膜电阻产品概述

一、产品基本信息

0201WMJ0303TEE是厚声电子(UNI-ROYAL) 推出的一款通用型贴片厚膜电阻,采用行业标准0201封装,专为低功率电路的分压、限流、滤波等基础功能设计。该型号平衡了成本与性能,具备宽温稳定性,适配消费电子、工业控制等多领域应用场景。

二、核心参数详解

该型号的参数明确了其应用边界与性能表现,关键指标如下:

  1. 阻值与精度:标称阻值30kΩ(三位数字标法“303”对应30×10³Ω),精度±5%——满足无需高精度的通用电路需求,同时降低成本;
  2. 功率等级:额定功率50mW——适配0201小封装的低功率场景,实际使用建议降额至30mW以内提升可靠性;
  3. 工作电压:最大工作电压25V——结合功率公式(P=U²/R),实际功耗约20.8mW(25V²/30kΩ),未超额定功率,确保安全;
  4. 温度系数:±200ppm/℃——表示温度每变化1℃,阻值变化±200×10⁻⁶,即100℃温差下阻值漂移±2%,满足宽温稳定要求;
  5. 工作温度范围:-55℃~+155℃——覆盖工业级温度区间,可适应低温存储、高温工作的极端场景(如户外设备、工业控制器)。

三、封装与工艺特点

  1. 封装规格:0201封装,尺寸约0.6mm(长)×0.3mm(宽)×0.23mm(厚)——体积小巧,适配高密度PCB设计,支持自动化贴装(SMT),大幅提升生产效率;
  2. 厚膜工艺优势:采用厚膜印刷工艺制造,相比薄膜电阻成本更低,且具备较好的抗浪涌能力与机械稳定性;膜层厚度适中,长期工作阻值漂移可控,适合批量应用的可靠性要求。

四、典型应用场景

结合参数特性,该型号主要适用于以下场景:

  1. 消费电子:手机、平板、智能手表的电源分压检测(充电电路电压反馈)、音频滤波(噪声抑制)、按键限流;
  2. 小型家电与智能硬件:遥控器、温湿度传感器的信号调理、小家电控制板的分压/限流环节;
  3. 工业控制辅助电路:压力传感器的低功率信号分压、小型PLC的辅助逻辑电路;
  4. 通信设备:路由器、交换机的指示灯限流、低功率射频电路的辅助匹配网络。

五、品牌与可靠性说明

厚声电子(UNI-ROYAL)是国内被动元器件龙头厂商,0201WMJ0303TEE具备以下可靠性优势:

  1. 宽温稳定性:-55℃~+155℃范围内,阻值漂移符合规格要求,适应极端环境;
  2. 焊接可靠性:封装适配常规回流焊(峰值温度≤260℃,焊接时间≤10秒),抗热应力能力强;
  3. 长期可靠性:厚膜工艺确保长期工作阻值变化率≤0.5%/1000小时,满足量产产品使用寿命要求;
  4. 环保合规:符合RoHS、REACH等国际环保标准,无铅无卤,适配绿色制造需求。

六、选型与使用注意事项

  1. 功率降额:实际工作功率建议不超额定功率的60%(30mW),避免过载失效;
  2. 静电防护:贴装过程需注意ESD防护(≤2kV接触放电),虽抗静电能力优于薄膜电阻,但仍需规范操作;
  3. 精度匹配:若需±1%以上精度,需更换高精度薄膜电阻,该型号仅适配±5%需求;
  4. 焊接规范:严格遵循0201封装回流焊曲线,避免温度过高/时间过长导致封装变形或膜层损坏。

该型号以高性价比、宽温稳定的特点,成为通用低功率电路的优选电阻之一,适配多种量产场景的可靠性需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.