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UNI-ROYAL 0402WGF1800TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF1800TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF1800TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 180Ω
- Electronic Component
- 50
- Electronic Component
- BM0257243683
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF1800TCE 产品概述
一、产品概况
0402WGF1800TCE 是 UNI-ROYAL（厚声）系列的贴片厚膜电阻，阻值 180Ω，精度 ±1%，封装为 0402（公制 1005）。该器件为低功率、尺寸微小的通用电阻元件，适用于高密度贴片电路板与便携式电子产品中的精密分压、偏置与信号匹配场合。
二、主要特性
- 厚膜工艺，性能稳定、成本效益高
- 阻值：180Ω，公差 ±1%，适合对精度有一定要求的电路
- 功率额定：62.5 mW（1/16W），适合低功耗场景
- 温度系数（TCR）：±100 ppm/℃，温漂控制良好
- 工作温度范围：-55 ℃ ~ +155 ℃
- 工作电压：最大 50 V
三、电气与环境参数
- 漏电流与噪声符合厚膜电阻常规规范，适配一般模拟与数字电路需求。
- 在高温或散热受限环境下，应按制造商的功率降额曲线进行选型和布局，避免长期满额定功率工作导致寿命下降。
四、封装与工艺建议
- 封装：0402（适用于高密度 SMT 组装）
- 焊接：建议遵循无铅回流焊工艺，峰值温度及时间以厂家回流曲线为准，避免反复多次高温循环。
- 存储与清洗：避免潮湿、高盐雾环境；清洗剂选择对厚膜无腐蚀性的溶剂。
- 贴装注意事项：在 PCB 布局时为保证散热与可靠性，应考虑阻值排列与热源的相对位置，必要时增加散热铜箔或改变布局以降低温升。
五、典型应用
- 手机、穿戴设备等便携式终端的信号偏置与限流
- 工业与通信设备中的分压网络与阻抗匹配
- 消费电子、传感器接口与低功耗测量电路
六、可靠性与质量保证
UNI-ROYAL（厚声）系列产品通过常规可靠性试验与 RoHS 环保要求，提供稳定的批次一致性和可追溯性。具体的温升、寿命与机械冲击/震动试验数据可在数据手册中查阅或向供应商索取。
如需完整数据手册、回流焊图谱或样品支持，请联系供应商以获取 0402WGF1800TCE 的完整技术资料与采购信息。
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