WMSIC Electronic Components

UNI-ROYAL 0402WGJ0180TCE

Model0402WGJ0180TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ0180TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ0180TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
18Ω
Electronic Component
10
Electronic Component
BM0263574790
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ0180TCE厚膜贴片电阻产品概述

一、产品基本定位与品牌背景

0402WGJ0180TCE是UNI-ROYAL(厚声)推出的工业级通用小功率厚膜贴片电阻,主打「小体积高密度、宽温稳定可靠、成本可控」三大核心优势,适配各类电子设备的基础信号/功率电路设计。厚声作为国内被动元件领域的资深制造商,产品通过ISO 9001、IEC 61000等多项国际认证,广泛应用于消费电子、工业控制、通信等行业,可靠性经市场长期验证。

二、核心参数规格详解

该电阻的参数明确覆盖基础电路设计需求,关键指标如下:

  • 阻值与精度:标称阻值18Ω,精度±5%(工业级通用精度),适用于非精密测量、信号分压等场景;
  • 功率与电压:额定功率62.5mW,最大工作电压50V,满足小信号电路(如传感器偏置、逻辑电平转换)的功率需求;
  • 温度特性:温度系数±200ppm/℃,工作温度范围-55℃~+155℃,宽温覆盖户外、工业高低温环境;
  • 封装尺寸:0402封装(英制代码,对应公制1005尺寸:1.0mm×0.5mm×0.3mm),体积仅为传统插件电阻的1/10,适配小型化设备。

三、关键性能特性

(一)厚膜工艺的稳定性优势

采用丝网印刷+高温烧结工艺,电阻膜层与陶瓷基底结合紧密,阻值长期稳定性优于碳膜电阻:常温下阻值漂移率≤0.1%/年,155℃高温存储1000h后阻值变化≤0.5%,满足长期使用需求。

(二)小体积适配高密度设计

0402封装是当前贴片电阻的主流小尺寸之一,1cm²PCB可布局约2000个该电阻,极大提升电路集成度,适配智能手机、可穿戴设备等对空间严苛的产品。

(三)宽温环境下的可靠性

工作温度覆盖工业级标准(-55℃~+125℃)的扩展(至155℃):-55℃时阻值变化≤±0.5%,155℃时阻值变化≤±1%,极端温度下仍保持稳定。

四、典型应用场景

该电阻的参数特性适配多领域基础电路:

  1. 消费电子:智能手机音频信号调理、可穿戴设备心率传感器分压、平板电脑电源滤波;
  2. 工业控制:小型PLC输入接口限流、PT100温度传感器辅助匹配、低压电机驱动信号检测;
  3. 通信设备:光纤收发器偏置电压调节、基站射频前端小信号匹配、路由器电源稳压反馈;
  4. 汽车电子:车载仪表盘背光控制、车门传感器信号分压(需结合整车EMC测试,部分场景需更高精度型号)。

五、封装与可靠性优势

(一)焊接兼容性与生产效率

0402封装为表面贴装设计,兼容回流焊、波峰焊等常规工艺,焊接后焊点可靠性高;无铅无卤设计符合RoHS 2.0标准,适配全球市场准入。

(二)可靠性验证

产品通过多项严苛测试:

  • 高温存储:155℃×1000h,阻值变化≤0.5%;
  • 温度循环:-55℃~+155℃×500次,阻值变化≤0.3%;
  • 湿度测试:85℃/85%RH×1000h,阻值变化≤0.4%; 满足IEC 60115-1(固定电阻器通用规范)工业级要求。

六、选型与使用注意事项

  1. 功率降额:实际功率建议≤额定值的50%(31.25mW),避免长期过负荷;
  2. 温度降额:125℃以上功率降至70%(43.75mW),155℃时降至50%;
  3. 电压限制:工作电压不得超过50V,防止膜层击穿;
  4. 精度匹配:若需±1%以内精度,需选择更高精度的厚膜/薄膜电阻。

该电阻凭借均衡的性能与成本优势,成为小功率电路设计的高性价比选择,可满足多数工业与消费电子场景的基础需求。

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