WMSIC Electronic Components

UNI-ROYAL 1206W4J0241T5E

Model1206W4J0241T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4J0241T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4J0241T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
240Ω
Electronic Component
1
Electronic Component
BM0257624237
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4J0241T5E 产品概述

一、产品简介

1206W4J0241T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,尺寸为1206(英制),额定阻值 240Ω,阻值精度 ±5%,额定功率 1/4W(250mW),工作电压上限 200V。适用于常见电子产品的通用限流、分压与偏置电路,兼顾成本与可靠性要求的场合。

二、主要技术参数

  • 阻值:240Ω
  • 精度:±5%(J级)
  • 功率:250mW(额定)
  • 最大工作电压:200V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 结构类型:厚膜(易焊接,成本低)
  • 封装:1206 表面贴片

三、产品特性

  • 温度范围宽,适合工业级环境(-55℃ 至 +155℃)。
  • TCR ±100 ppm/℃,在温度变化下有较好的阻值稳定性,适合一般精度要求的应用。
  • 厚膜工艺成本优势明显,量产一致性好,适配自动化贴装与回流焊工艺。
  • 额定功率在常温条件下可满足多数低功耗限流与分压场景;高温环境需按功率降额使用。

四、典型应用

  • 消费类电子:电视、机顶盒、家电控制板等。
  • 通信设备:终端电路、阻抗匹配与偏置网络。
  • 工业控制:传感器接口、模拟前端限流电阻。
  • 电源与信号处理:分压、滤波网络中的阻性元件。

五、封装与供应

此类1206贴片电阻通常以卷带(Tape & Reel)方式供货,便于SMT贴装机高速贴装。采购时请确认包装数量与潮湿敏感等级(MSL)要求,以便合理存储与使用。

六、安装与注意事项

  • 焊接:建议遵循制造商的回流焊温度曲线与行业标准,避免超温或长时间过热导致电阻性能退化。
  • 降额使用:高环境温度下应按厂方功率-温度降额曲线设计,以免超出热极限。
  • 存储与处理:防潮处理,避免机械压力和刮擦,贴装时注意避免过度弯曲基板或强力挤压焊盘。
  • 质量检验:常规可做阻值、耐温循环、焊接可靠性与绝缘电压测试以验证可靠性。

如需更详细的电气特性曲线、功率降额表或回流焊工艺参数,可向供应商索取完整数据手册以便设计核对。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.