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UNI-ROYAL 25121WJ0102T4E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 25121WJ0102T4E
- Type
- UNI-ROYAL
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 25121WJ0102T4E
- Electronic Component
- 1
- Package
- 2512
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.06g
- Electronic Component
- 1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257342354
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
25121WJ0102T4E 产品概述
一、产品概况
25121WJ0102T4E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装规格为 2512（6.35 × 3.2 mm），标称阻值 1 kΩ，阻值公差 ±5%（J），额定功率 1W。该器件适用于需要中等功率承受能力且对成本敏感的通用电子设计场合，工作电压上限为 200V，工作温度范围 -55℃ 至 +155℃，温度系数典型值 ±100 ppm/℃。
二、主要电气参数
- 电阻类型：厚膜电阻（SMD）
- 标称阻值：1 kΩ
- 阻值公差：±5%（J）
- 额定功率：1W（环境依赖，应考虑散热）
- 最大工作电压：200V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
三、结构与制造特点
该款电阻采用厚膜工艺，将阻性碳/金属浆料印刷在陶瓷基片上并经过高温烧结，端接以金属化焊盘并覆盖保护层。厚膜结构成本低、制造稳定，适合批量生产。2512 大封装为器件提供更好的散热路径与较高的功率承受能力，机械强度也优于小封装产品。
四、热性能与散热建议
1W 额定功率基于推荐的环境条件与热阻参数，实际使用时需考虑 PCB 散热设计：增大焊盘铜面、增加过孔与内层铜连通、靠近散热平面布置等均能显著降低结温。建议在高环境温下进行功率降额（如超过 70℃ 开始线性降额），并避免持续在器件最高结温附近工作以延长寿命。
五、适用场景
- 开关电源与线性电源中的分压、放电/泄放电阻
- 驱动与控制电路中的限流、拉/下拉电阻
- 功率分压与电流取样（非高精度测量）
- 工业设备、仪表和通信终端等需要耐高温和中等功耗的应用
六、封装布局与焊接注意事项
- PCB 尺寸：2512 标准封装约 6.35 × 3.2 mm，焊盘设计应兼顾焊接可靠性与散热性能。
- 回流焊接：遵循常规无铅回流温度曲线，避免过高峰值温度或长时间高温暴露。
- 焊接后检验：注意焊点完整、无虚焊及开裂。
- 存储与防潮：厚膜电阻通常抗湿性较好，但长期存储或严苛回流条件下仍建议遵守制造商的包装与存储说明。
七、可靠性与限制
厚膜贴片电阻具有良好的机械强度与抗振性能，但与金属膜、金属薄膜或线绕电阻相比，在长期稳定性与噪声特性方面存在一定差距。对于要求高精度、低漂移或极低噪声的应用，应考虑更高等级的电阻类型。另外，脉冲功率能力需按制造商脉冲规格评估，避免超出器件瞬态承受能力。
八、选型建议
若设计需要成本可控、封装较大且要求 1W 级别功率，且容忍 ±5% 阻值与 ±100 ppm/℃ 的温度变化，25121WJ0102T4E 是合适选择。若需更高精度或更低 TCR，可考虑 ±1% 精度或金属膜/合金箔类替代件；若功率或脉冲需求更高，则应选择更大封装或线绕类电阻。
如需完整数据手册、焊接曲线或可靠性测试报告，可联系供应商获取详细规格文件与应用说明。
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