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UNI-ROYAL 0402WGF3323TCE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF3323TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF3323TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 332kΩ
- Electronic Component
- 50
- Electronic Component
- BM0263477469
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF3323TCE厚膜贴片电阻产品概述
一、核心参数概览
0402WGF3323TCE是UNI-ROYAL（厚声）推出的0402封装厚膜贴片电阻，核心参数明确适配小信号电路需求：
- 阻值：332kΩ（符合E96系列阻值编码）；
- 精度：±1%（常规精密级）；
- 额定功率：62.5mW（小功率等级）；
- 工作电压：50V（直流/交流通用）；
- 温度系数：±100ppm/℃（阻值温度漂移可控）；
- 工作温度：-55℃~+155℃（宽温覆盖）；
- 封装：0402（英制，公制约1.0mm×0.5mm）。
二、关键性能特点
依托厚膜工艺与参数设计，该电阻具备实用优势：
- 宽温阻值稳定：±100ppm/℃温度系数结合-55℃~+155℃工作范围，可避免极端温度下阻值漂移导致的电路性能波动（如工业现场的高低温循环）；
- 小功率适配精准：62.5mW额定功率虽为小功率，但针对分压、滤波、反馈等小信号回路，可提供充足余量（实际应用中控制在50mW内更可靠）；
- 厚膜工艺优势：丝网印刷+烧结的厚膜制程，膜层附着力强，抗振动冲击性能优于薄膜电阻，且成本更具竞争力；
- 小型化高密度兼容：0402封装紧凑，可节省PCB空间（适配智能手机、智能穿戴等高密度设计），同时兼容主流SMT贴装设备，便于自动化生产。
三、适用应用场景
基于性能特点，该电阻可覆盖多领域：
- 消费电子：智能手机音频接口分压电阻、平板电脑电源滤波电阻、智能手表传感器信号调理电阻；
- 工业控制：小型PLC辅助信号电路电阻、温度传感器放大反馈电阻、低压配电状态监测分压电阻；
- 汽车电子：车载中控按键反馈电阻、低温启动辅助电路电阻、胎压监测信号调理电阻；
- 通信设备：路由器高速信号滤波电阻、基站射频前端小信号分压电阻、光纤收发器状态指示电阻；
- 医疗电子：小型监护仪生理信号处理电阻、便携式医疗设备电源管理辅助电阻。
四、可靠性与环境适应性
设计充分考虑实际环境挑战：
- 宽温耐受：-55℃~+155℃覆盖工业现场、汽车发动机舱等极端温度，无需额外降额；
- 抗环境应力：厚膜工艺耐湿性、抗盐雾性能优于薄膜电阻，适配潮湿/沿海环境；0402封装抗振动冲击满足IEC 60068-2-6标准；
- 余量设计：额定功率/电压的80%降额使用（50mW、40V），可进一步提升长期可靠性（如连续工作1000小时以上阻值变化≤0.5%）。
五、品牌与封装优势
- 品牌保障：UNI-ROYAL（厚声）是全球知名电阻制造商，产品通过ISO 9001、IATF 16949认证，质量稳定；
- 封装兼容性：0402封装符合IPC标准，兼容Altium、Cadence等设计软件，支持回流焊/波峰焊工艺，生产效率高。
总结：0402WGF3323TCE凭借小型化、宽温稳定、成本可控的特点，成为消费电子、工业、汽车等领域小信号电路的实用选择，可满足多场景下的基本性能与可靠性需求。
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