WMSIC Electronic Components

UNI-ROYAL 0603WAF3600T5E

Model0603WAF3600T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF3600T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF3600T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
360Ω
Electronic Component
10
Electronic Component
BM0257245621
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF3600T5E 产品概述(UNI-ROYAL 厚膜贴片电阻 0603 360Ω ±1%)

一、产品简介

0603WAF3600T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,标准0603封装,阻值360Ω,精度±1%。此款电阻采用厚膜工艺制造,适配现代表面组装工艺,适用于空间受限、性能稳定性要求较高的电子设备中作为限流、分压、阻抗匹配和信号滤波等用途。

二、主要电气与环境参数

  • 电阻类型:厚膜电阻
  • 阻值:360Ω
  • 精度:±1%(1/4%级常见应用除外)
  • 额定功率:100 mW(在额定温度条件下)
  • 最高工作电压:75 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ 至 +155 ℃
  • 封装:0603(典型外形约 1.6 mm × 0.8 mm)

三、特点与优势

  • 小型化封装:0603体积小,利于高密度贴装与紧凑电路设计。
  • 精度与稳定性平衡:±1%精度适合常见模拟与数字电路的精密需求,TCR±100 ppm/℃在中温变化环境下有良好稳定性。
  • 宽温工作:-55℃至+155℃的温度范围,满足工业级温度要求的应用。
  • 可靠的厚膜工艺:成本效益高且生产一致性好,适合大批量应用。

四、典型应用场景

  • 消费类电子:手机配件、可穿戴设备、便携式仪器中的限流与分压。
  • 工业控制:传感器接口、信号调理和阻抗匹配。
  • 通信设备:射频前端与基带模块的偏置与滤波网络(注意功率与频率适配)。
  • 仪器仪表:测量电路中的参考电阻与分流网络。

五、封装与机械兼容

0603为常用贴片尺寸(约1.6×0.8 mm),适配主流贴片机及回流焊工艺。包装通常为带卷(tape & reel),便于自动化装配与高速贴装生产线使用。

六、使用与焊接注意事项

  • 焊接工艺:建议使用推荐的回流焊温度曲线进行焊接,避免超过器件的最高温度限制和重复高温循环。
  • 功率降额:在高环境温度或散热受限条件下,应对额定功率进行降额考虑,确保实际工作功耗低于额定值以延长寿命并保证可靠性。
  • 机械应力:贴片电阻对基板弯曲与冲击敏感,焊接后避免强烈机械应力或过度弯曲。
  • 储存与搬运:按正常电子元件储存规范处理,避免潮湿、高温及异物污染。

七、选型与可靠性建议

  • 校核电压与功耗:在设计中同时校核电阻上的实际功率和跨压,确保不超过100 mW与75 V 的器件极限。
  • 温度影响评估:考虑TCR对电路精度的影响,必要时在高精度场合选用更低TCR或金属膜/薄膜方案。
  • 环境和寿命测试:在应用环境苛刻(高湿、高温、振动等)时,建议进行加速寿命或环境应力测试以验证长期可靠性。

综上,0603WAF3600T5E 提供了小型化封装下的良好电气性能与温度稳定性,适合广泛的消费与工业电子应用。在设计与焊接过程中注意功率与温度管理,即可获得稳定可靠的长期工作表现。

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