WMSIC Electronic Components

UNI-ROYAL 1210W2J0121T5E

Model1210W2J0121T5E
Package1210
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1210W2J0121T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
500mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1210W2J0121T5E
Electronic Component
1
Package
1210
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.034g
Electronic Component
120Ω
Electronic Component
1
Electronic Component
BM0263477294
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1210W2J0121T5E厚膜贴片电阻产品概述

一、产品基本属性

1210W2J0121T5E是UNI-ROYAL(厚声) 品牌推出的厚膜贴片电阻(SMD),属于表面贴装型无源元件。该型号采用1210标准封装,核心功能为电路中的分压、限流、阻抗匹配等,适配自动化贴片生产工艺,广泛覆盖消费电子、工业控制等多领域应用。

二、核心性能参数解析

该电阻的关键参数符合工业级应用要求,具体如下:

  • 阻值与精度:标称阻值120Ω,精度等级±5%(型号中“J”标识对应此精度),满足常规电路的阻值误差需求;
  • 功率容量:额定功率500mW(0.5W),可稳定承载中等功率负载,避免过热损坏;
  • 温度特性:温度系数(TCR)±100ppm/℃,即环境温度每变化1℃,阻值变化约±0.012Ω,适配宽温环境下的阻值稳定性;
  • 工作参数:最大工作电压200V,工作温度范围覆盖**-55℃~+155℃**,支持极端温度场景下的长期运行。

三、封装与物理特性

1210W2J0121T5E采用1210封装(公制尺寸约3.2mm×2.5mm×0.55mm),属于小型化表面贴装封装,具备以下特点:

  • 无引线设计,适配回流焊、波峰焊等自动化工艺,生产效率高;
  • 体积紧凑,可节省PCB布局空间,适合高密度电路设计;
  • 封装结构稳定,能承受焊接热应力,降低虚焊风险。

四、典型应用场景

基于性能与封装特性,该电阻适用于以下场景:

  1. 消费电子:手机、平板、智能穿戴的电源电路(如DC-DC反馈电阻)、信号分压网络、音频阻抗匹配;
  2. 工业控制:PLC输入输出接口、传感器信号调理、电机驱动限流,宽温适配工业现场环境;
  3. 通信设备:基站、路由器的电源滤波、射频阻抗匹配,满足通信设备可靠性要求;
  4. 电源模块:开关电源、线性电源的限流、分压,500mW功率适配中等功率设计。

五、品牌与可靠性保障

UNI-ROYAL(厚声)作为国内知名电阻制造商,该产品具备成熟工艺体系:

  • 经过严格可靠性测试(高温存储155℃/1000h、温度循环-55℃~+155℃等),确保长期稳定;
  • 符合RoHS 2.0、REACH环保标准,无有害物质;
  • 批量供应稳定,参数一致性好,适合规模化生产。

该产品以高性价比、宽温可靠性适配多领域需求,是常规电路设计的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.