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UNI-ROYAL 1206W4F270JT5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F270JT5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F270JT5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 27Ω
- Electronic Component
- 1
- Electronic Component
- BM0257341655
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F270JT5E 产品概述
一、产品概述
1206W4F270JT5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装为 1206（英制），阻值 27Ω，精度 ±1%，额定功率 0.25W（250mW），工作电压 200V，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃ 至 +155℃。该型号以稳定的电气性能和良好的批量一致性适用于一般电子线路中的限流、分压、阻尼及小功率能耗场合。
二、主要参数（摘要）
- 电阻类型：厚膜电阻
- 封装：1206（3216公制）
- 阻值：27Ω
- 精度：±1%
- 额定功率：250mW
- 最大工作电压：200V
- 温度系数：±100ppm/℃
- 工作温度：-55℃ ～ +155℃
三、产品特点
- 温度特性良好：TCR ±100ppm/℃ 可保证在宽温区间内阻值稳定性。
- 高可靠性：厚膜工艺成熟，对焊接和机械应力有较强耐受性。
- 小体积高密度装配：1206 封装适合自动贴装和回流焊，便于 SMT 生产线使用。
- 适用电压较高：200V 的额定工作电压使其可用于中低电压应用场合。
四、典型应用
- 功率受限的电源分压、偏置网络与参考电路。
- 信号链中的阻尼与匹配（滤波器、输入阻抗控制）。
- 工业控制、电表、仪器仪表等需要宽温工作的电子设备。
- 消费类电子、通信设备的常规限流与负载电阻。
五、PCB 布局与焊接建议
- 推荐使用符合 IPC 标准的 1206 焊盘布局，确保焊锡膏量均匀，良好热传导。
- 回流焊工艺应遵循器件最大耐热规范（参考 J-STD-020），建议单次回流，避免重复高温循环。
- 为保证功率散热，敏感电路应为该电阻提供适当的热沉或铜箔面积；在高温、高功率场合对额定功率进行降额使用（建议在高环境温度下参考厂方功率降额曲线）。
- 避免在封装两端施加过大的机械应力（如注塑或强力折弯），贴片过程中注意拾放头压力与回流 PCB 支撑。
六、可靠性与储存
- 工作环境避免长期潮湿、高盐雾及强腐蚀气体。
- 常温下干燥包装存储，开封后的元件如无法立即使用，建议按生产商推荐条件（防潮袋及干燥剂）保存。
- 推荐在设计中考虑过流、过压保护和良好散热路径，以延长使用寿命并降低漂移风险。
如需更详细的电气特性曲线、功率降额图或可靠性测试报告（如温度循环、湿热、焊接可靠性），可向供应商索取完整规格书以便在设计中准确选型与仿真验证。
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