Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0402WGF680JTCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF680JTCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF680JTCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 68Ω
- Electronic Component
- 10
- Electronic Component
- BM0257624234
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF680JTCE 产品概述
一、产品简介
0402WGF680JTCE 是 UNI-ROYAL（厚声）系列的贴片厚膜电阻，封装为 0402（公制 1005），阻值 68Ω，精度 ±1%，额定功率 62.5mW（1/16W），工作电压 50V。该器件采用厚膜工艺制造，适合高密度表贴电路中作为分流、限流、阻抗匹配与偏置网络等用途。
二、主要参数
- 阻值：68Ω
- 精度：±1%（J 级）
- 额定功率：62.5mW
- 最大工作电压：50V
- 温度系数（TCR）：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0402（1005公制）
- 品牌：UNI-ROYAL（厚声）
三、结构与工艺
本产品采用陶瓷基片为载体，表面喷覆厚膜电阻浆料并经高温烧结形成阻性层，两端焊接金属端子，外层通常为防护涂层以提高湿气与机械可靠性。表面可做无铅镀层以兼容现代无铅回流焊工艺。
四、主要特性与优势
- 小体积、高度集成，适用于空间受限的移动与消费电子产品。
- ±1% 精度和±100ppm/℃ 的温漂，适合对阻值稳定性有较高要求的电路。
- 宽工作温度范围（-55℃~+155℃），在严格环境下仍能保持性能。
- 兼容标准无铅回流焊工艺，便于 SMT 生产线直接贴装与回流焊接。
五、典型应用场景
- 手机、平板、可穿戴设备等便携式电子产品的限流、分压与偏置电路。
- 高频信号中的阻抗匹配、终端电阻与阻尼网络（注意功率限制）。
- 精密电源、传感器前端的小功率匹配与滤波网络。
- 工业控制板与汽车电子中作为小功率参照或保护元件（需按温度环境评估功率）。
六、设计与使用建议
- 由于封装尺寸小且额定功率低，建议在 PCB 设计时关注散热路径，避免长期满功率工作。一般建议实际工作功率控制在额定功率的 50%~70% 以内以提高可靠性。
- 兼容无铅回流工艺（峰值温度 ≤ 260℃），回流曲线建议遵循器件与 PCB 生产工艺规范。
- 在高湿或化学腐蚀环境下，可考虑使用额外涂覆或选择更高可靠性规格。
- 焊接、存储与搬运时避免对电阻施加过大机械应力，防止端子裂纹与失效。
七、包装与订购信息
0402WGF680JTCE 常见包装为卷带（Tape & Reel），适配自动贴片机供料。订购时请确认阻值、精度、包装数量与需用的回流兼容性。如需样品或大批量采购，请联系供应商或授权代理商获取详细器件数据手册与可靠性试验报告。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
