WMSIC Electronic Components

UMW BV05C

ModelBV05C
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW BV05C
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
BV05C
Electronic Component
1
Package
SOD-323
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Cj- Capacitor
1.5pF
Electronic Component
BM0226612840
Operating Temperature
55℃~+150℃
Voltage
9.8V;18.3V
Electronic Component
IEC 61000-4-2
Current(Ir)
5uA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV05C 产品概述

一、产品简介

BV05C 是 UMW(友台半导体)推出的一款低容抗静电瞬态抑制二极管(TVS/ESD),封装为 SOD-323,专为 5V 系统的高速接口与电源线提供瞬态过压、静电放电(ESD)保护。器件体积小、响应快、结电容低,适合空间受限且对信号完整性要求高的应用场景。

二、主要性能参数

  • 反向工作电压 Vrwm:5 V
  • 击穿电压(典型):6 V
  • 钳位电压:9.8 V(典型);18.3 V(极端脉冲条件)
  • 峰值脉冲电流 Ipp:8 A(8/20 μs)
  • 峰值脉冲功率 Ppp:150 W(8/20 μs)
  • 反向漏电流 Ir:5 μA(常温)
  • 结电容 Cj:1.5 pF(低容,利于高速信号)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 防护等级:符合 IEC 61000-4-2 静电放电保护标准

三、产品特点与优势

  • 小体积封装(SOD-323),便于高密度 PCB 布局与自动贴装。
  • 低结电容(1.5 pF),对 USB、HDMI、LVDS 等高速差分信号影响小,保持信号完整性。
  • 高峰值承受能力(8 A / 150 W @ 8/20 μs),可有效吸收常见的静电和瞬态浪涌能量。
  • 低漏电(5 μA),对待保护电路的静态功耗影响极小。
  • 宽温度工作范围,适合工业与消费类产品长期可靠运行。

四、典型应用

  • USB、UART、GPIO 等 5 V 信号线的接口保护
  • 移动设备、可穿戴设备、消费电子的 I/O 端口
  • 工业控制、楼宇自控中对单线防护需求场合
  • 通讯设备、摄像头模组等对信号完整性有要求的保护方案

五、使用建议与 PCB 布局要点

  • 将 BV05C 靠近被保护的器件引脚或连接器放置,针脚间走线越短越好,以降低寄生感抗和环路面积。
  • 对地保护时应保证接地平面低阻、短路径;若为差分线保护,可在差分对两端各放置 TVS(根据系统是单向或双向选择器件类型)。
  • 避免在 TVS 与器件之间并联过多滤波元件,必要时选择与保护器件匹配的网络以免影响响应速度。
  • SOD-323 封装焊盘按厂商推荐尺寸设计,保证良好焊接与散热。

六、可靠性与选型提示

  • BV05C 以 5 V 系统为目标,请确认系统最大工作电压与峰值脉冲条件与器件参数匹配。
  • 若系统需双向钳位(对信号正负摆幅均需保护),请核对器件是否为双向型号或选用对应双向 TVS。
  • 在高能量冲击或反复冲击场景,应做系统级 ESD/浪涌测试验证器件与 PCB 布局的综合防护能力。

BV05C 提供紧凑体积、低容抗、高能量吸收能力的瞬态抑制方案,适合对空间与信号完整性有双重要求的 5 V 接口保护应用。有关封装尺寸、典型应用电路及详细电气特性,建议参考 UMW 官方数据手册并与供应商确认。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.