Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW SI2309A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW SI2309A
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- SI2309A
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0226015833
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.25W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SI2309A 产品概述
一、产品简介
SI2309A 是友台半导体（UMW）推出的一款表面贴装 P 沟道功率 MOSFET，额定漏源电压 60V，适用于中低电流、高侧开关与电源管理场合。器件采用 SOT-23 小封装，适合体积受限的便携式与消费类电子设计。
二、主要电气参数
- 类型：P 沟道 MOSFET（表面贴装）
- Vdss（漏源耐压）：60 V
- Id（连续漏极电流，Ta）：1.25 A
- Pd（耗散功率，Ta）：1.25 W
- RDS(on)：340 mΩ @ |Vgs|=10 V；550 mΩ @ |Vgs|=4.5 V
- Vgs(th)（阈值电压）：|Vgs(th)| ≈ 3 V @ 250 μA
- Qg（总栅极电荷）：5.4 nC @ 10 V
- 工作温度范围：-55 ℃ ~ +150 ℃
- 封装：SOT-23
- 品牌/型号：UMW（友台） SI2309A
三、性能特点与使用建议
- 导通性能：在 |Vgs|=10 V 时 RDS(on)≈340 mΩ，适合要求较低导通损耗的高侧开关；若驱动电压受限（约4.5 V），RDS(on) 仍为 550 mΩ，适用低电流或通断控制场景。
- 门极驱动：作为 P 沟道器件，需施加负向栅源电压以导通（相对源极）。为获得最低导通阻抗，建议驱动到接近 -10 V（或将栅极拉到系统地电位，根据电源拓扑决定）。
- 开关损耗：Qg=5.4 nC，在高频开关时需考虑驱动电流与开关损耗，合理选用驱动器或限制切换频率。
- 热管理：器件在 SOT-23 小封装中 Pd=1.25 W（Ta）受限，PCB 散热（铜面、焊盘和过孔）设计对长期可靠性至关重要。大电流工况下应注意温升和热阻。
四、典型应用场景
- 便携设备、消费电子的正电源高侧开关与负载断开。
- 电池管理系统中用于单节或多节电池保护的开/关控制。
- 电源路径选择、电源反相保护与低速 DC-DC 管理。
- 其他对体积、成本敏感且电流在数百毫安至1A范围的开关场合。
五、布局与可靠性要点
- 将源、漏走线最短且加大铜箔面积以降低导通损耗和热阻。
- 栅极走线宜短且加阻尼以抑制振铃；开关频繁时考虑门极串联电阻与驱动能力。
- 裸露铜或散热岛连接到器件焊盘以提升散热能力；必要时使用过孔将热量传导至底层铜箔。
- 操作时注意静电防护与正确的焊接温度曲线，避免器件损伤。
总结：SI2309A 在 60V 电压等级与 SOT-23 封装下提供了适中的导通阻抗与门极电荷，适合中低功率高侧开关与电源管理应用。设计时重点考虑门极驱动电平与 PCB 热处理即可发挥其良好性价比。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
