WMSIC Electronic Components

UMW 2SC2712

Model2SC2712
PackageSOT-23
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW 2SC2712
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
2SC2712
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0229464355
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
80MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SC2712 产品概述

一、概述

2SC2712 是友台半导体(UMW)推出的一款小信号 NPN 双极型晶体管,采用 SOT-23 小封装,适合空间受限的消费电子和通信终端。其设计在低功耗和中等电流范围内提供稳定的放大和开关性能,适用于通用放大、缓冲驱动以及高频小信号处理场合。

二、主要特性

  • 晶体管类型:NPN
  • 集电极电流 Ic:最大 150 mA
  • 集射极击穿电压 Vceo:50 V(绝对最大值)
  • 耗散功率 Pd:150 mW(环境温度相关,请参照降额曲线)
  • 直流电流增益 hFE:典型 70(测试条件 2 mA, VCE=6 V)
  • 特征频率 fT:80 MHz,适用于 VHF 级别的小信号放大与高速开关
  • 集电极截止电流 Icbo:典型 100 nA,低漏电利于高阻态性能
  • 集电极饱和电压 VCE(sat):典型 250 mV(在规定测试电流下)
  • 射基极击穿电压 Vebo:5 V(注意基极反向耐压限制)
  • 工作温度范围:-55 ℃ ~ +150 ℃

三、典型应用

  • 小信号放大器(前置放大、音频/射频前端)
  • 低电压开关与驱动(LED 驱动、继电器/固态继电器前级)
  • 高速开关电路与脉冲驱动(受限于功耗和封装散热)
  • 通信设备中的缓冲级与电平转换

四、热与可靠性注意事项

SOT-23 封装的散热能力有限,标称耗散功率 150 mW 是在特定热阻与温度条件下的额定值。实际设计中须按厂商提供的功耗降额曲线进行热设计:随着环境温度升高,应线性降低允许耗散功率;长时间工作接近额定耗散会影响器件寿命。电路布局建议短而粗的集电极与地回流路径,避免局部热堆积。

五、使用建议

  • 开关应用时在基极串联限流电阻以限制基极电流并控制开关速度;避免基极-发射极反向电压超过 Vebo(5 V)。
  • 放大应用中,保持工作点在安全区域,避免集电极电压或电流瞬态超过 Vceo 与 Ic 的绝对极限。
  • 若需更高功率或更低饱和压,请考虑更大封装或功率器件替代。
  • 高频设计时关注寄生电容与引线电感,合理布局以发挥 80 MHz 的 fT 优势。

六、封装与采购

封装:SOT-23,适合贴片装配与自动化生产。
品牌:UMW(友台半导体)。
在选型和实际生产前,建议参考 UMW 的完整数据手册以获取详尽的测试条件、典型特性曲线与封装引脚定义,确保与 PCB 设计和热管理方案匹配。

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