WMSIC Electronic Components

UniOhm 0402WGF619JTCE

Model0402WGF619JTCE
Package0402
BrandUNIOHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Uni Ohm 0402WGF619JTCE
Type
UNIOHM
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNIOHM
Electronic Component
0402WGF619JTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
61.9Ω
Electronic Component
50
Electronic Component
BM0263453954
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF619JTCE 产品概述

一、产品简介

0402WGF619JTCE 是 UniOhm(台湾厚声)推出的一款 0402 封装厚膜贴片电阻,标称阻值 61.9 Ω,精度 ±1%,额定功率 62.5 mW(1/16W 级别),工作电压标称 50 V,温度系数(TCR)为 ±100 ppm/℃,工作温度范围 -55 ℃ 至 +155 ℃。该器件体积小、重量轻,适用于高速贴装设备,兼容波峰焊和回流焊工艺,适合高密度、轻量化电子产品的电路设计与量产组装。

二、主要参数(概要)

  • 品牌:UniOhm(台湾厚声)
  • 系列/型号:0402WGF619JTCE
  • 封装:0402(公制 1005)
  • 阻值:61.9 Ω
  • 精度:±1%(J)
  • 功率:62.5 mW(典型值/额定,1/16W)
  • 额定工作电压:50 V(器件耐压标称)
  • 温度系数:±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 制程类型:厚膜电阻
  • 焊接适配性:波峰焊、回流焊兼容,适用于自动贴片机

三、产品特点

  • 小尺寸、高密度适配:0402 封装占板面积小,适合高密度 PCB 布局与便携设备应用。
  • 成本与产能优势:厚膜工艺成熟,单位成本低,适合大批量生产以降低整机成本。
  • 自动化组装友好:设计与贴片机、回流焊、波峰焊兼容,降低人工焊接和后工序成本。
  • 温度稳定性:±100 ppm/℃ 的 TCR 在多数通用电路中能保证良好的温度漂移控制。
  • 宽温工作范围:-55 ℃ 至 +155 ℃,可用于汽车电子(非关键安全回路)、工业及消费电子等较广温度工况。

四、典型性能与使用注意

  • 功率与电压关系:标称功率 62.5 mW,按 P = V^2 / R 计算,若仅按阻值与功率限制,能够承受的最大直流电压约为 1.97 V(V = √(P·R) ≈ √(0.0625×61.9) ≈ 1.97 V)。因此,尽管器件标称工作电压为 50 V(为器件绝缘/结构耐压指标),在实际电路设计时必须以功率限制为准,避免在阻件上施加超过允许功耗的电压而引起过热或失效。
  • 温度漂移举例:TCR 为 ±100 ppm/℃,温度变化 100 ℃(例如从 25 ℃ 到 125 ℃)时,阻值变化约为 0.619 Ω(≈1.0%),在精密要求较高的应用需考虑温漂补偿或选择更低 TCR 的元件。
  • 可靠性考量:厚膜电阻在热冲击、湿热和机械振动等环境下表现良好,但与薄膜或金属膜精密电阻相比长期精度保持稍逊,需依据可靠性测试与环境要求选型。

五、适用场景

  • 消费类便携设备:智能手表、蓝牙耳机、小型传感器模块等对体积、重量敏感的电路。
  • 通信与网络设备:高密度 PCB 上的分流、电流检测与偏置网络(注意功率匹配)。
  • 工业控制与仪器:非高精度的温度补偿、电压分压与阻抗匹配电路。
  • 量产电子产品:需要降低元件成本且兼顾自动化装配效率的场景。

六、设计与贴装建议

  • 选型核对功率与电压:在 PCB 设计时优先按照功率和实际工作电压(P = V^2/R)确认余量,尽量留有安全裕度。
  • 贴装与焊接:器件兼容回流与波峰焊,但建议遵循 PCB 厂与贴片厂的工艺规范,采用厂家推荐的回流曲线与焊膏印刷厚度,以保证焊点可靠性。
  • 焊盘与机械应力:使用厂商或 IPC 建议的 0402 封装焊盘布局,避免过大的焊盘张力或 PCB 弯曲引起的机械应力。
  • 温度环境与降额:在高温或散热条件受限的场合,应对额定功率进行降额处理并在样机测试中验证温升与长期稳定性。

七、可靠性与质量保证

UniOhm(台湾厚声)为成熟的被动元件供应商,0402WGF 系列经过批量化生产流程控制与出厂测试。建议在产品开发阶段与供应商确认批次一致性、可靠性测试(热循环、湿热、机械冲击等)以及包装与出货状态,以满足长期量产与售后质量要求。

总结:0402WGF619JTCE 以其极小体积、良好的贴装兼容性和经济性,适合大量采用贴片自动化生产的轻量化电子产品。设计时重点核查功率散耗与实际工作电压,并在高温或关键应用场景中做好降额与验证,以确保长期可靠运行。

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