Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UniOhm 1206W3F560MT5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 1206W3F560MT5E
- Type
- UNIOHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 333mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNIOHM
- Electronic Component
- 1206W3F560MT5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 56mΩ
- Electronic Component
- 1
- Electronic Component
- BM0263453955
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±800ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W3F560MT5E 产品概述 — UniOhm（台湾厚声）1206厚膜56mΩ±1%电阻
一、产品简介
1206W3F560MT5E 为 UniOhm（台湾厚声）系列厚膜贴片电阻，阻值 56 mΩ，公差 ±1%，额定功率 333 mW，工作电压 200 V。封装为 1206（英制），适配自动贴片与高速组装设备，特别针对对低阻值、高可靠性有要求的便携与车载电子产品而设计。
二、主要特性
- 小尺寸、重量轻，节省电路板空间与重量。
- 采用厚膜工艺，电阻稳定性好、成本优势明显。
- 支持波峰焊与回流焊工艺，适配常见 SMT 生产线。
- 环保合规：符合 RoHS 指令，满足无卤要求。
- 工作温度范围宽：-55 ℃ 至 +155 ℃，可在严苛环境中长期工作。
- 温度系数（TCR）：±800 ppm/℃，适合一般电流检测与分流应用。
三、应用场景
- 导航仪（GPS）与定位模块的电流检测与保护。
- 手机及移动终端电源管理、充放电监控。
- 电源模块、DC-DC 转换器及电池管理系统（BMS）的电流分流与测量。
- 其他需要低阻值电流取样、限流或分压的消费电子与工业设备。
四、使用与选型建议
- 低阻值测量建议配合差分放大器或四端（Kelvin）测量以降低接触与引线误差对读数的影响。
- 在高功率或高环境温度场合应考虑功率降额与散热条件，确保实际使用点在安全范围内。
- 对于对温漂敏感的设计，应评估 ±800 ppm/℃ 带来的测量误差并进行校准或温度补偿。
- 推荐与同厂家相匹配的卷带（Tape & Reel）包装以保证贴片机装配效率（具体包装方式请咨询供应商）。
五、可靠性与质量保证
UniOhm（台湾厚声）采用成熟的厚膜制程与严格的质量管控，产品在常规焊接工艺（波峰焊、回流焊）后仍能保持性能稳定。符合无卤与 RoHS 要求，适合消费电子与精密仪器的环保设计需求。若需样品测试或更详细的可靠性数据（如温度循环、湿热、冲击振动等试验结果），建议直接联系供应商获取认证报告与应用支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
