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UniOhm 0402WGF221JTCE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 0402WGF221JTCE
- Type
- UNIOHM
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNIOHM
- Electronic Component
- 0402WGF221JTCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 22.1Ω
- Electronic Component
- 50
- Electronic Component
- BM0263453953
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF221JTCE 产品概述
一、产品简介
0402WGF221JTCE 为 UniOhm（台湾厚声）系列厚膜片式电阻，阻值 22.1Ω，公差 ±1%，额定功率 62.5mW，允许工作电压 50V，温度系数 ±100ppm/℃，工作温度范围 -55℃ 至 +155℃。采用 0402 小尺寸封装，体积小、重量轻，适配自动贴装设备，适合波峰焊与回流焊工艺，便于大批量表面贴装生产与成本控制。
二、主要特性
- 封装：0402（超小型 SMD），适合高密度 PCB 布局。
- 阻值与精度：22.1Ω，±1% 精度，满足中高精度电阻网络需求。
- 功率与电压：额定功率 62.5mW，最高工作电压 50V（请按电路条件考虑功率分配与散热）。
- 温度稳定性：TCR ±100ppm/℃，在宽温区间仍能保持较好阻值稳定性。
- 环境适应性：工作温度 -55℃~+155℃，适合工业与消费类多种环境。
三、设计与使用建议
- 功率散热：标称功率基于推荐焊盘和 PCB 散热条件，实际应用中应考虑环境温度与散热路径进行降额设计。
- 焊接工艺：兼容波峰焊与回流焊；建议遵循焊料与 PCB 的回流曲线规范，避免超过元件允许的最高温度和过长高温时间，以保证可靠性。
- 布局与封装：采用厂商推荐的焊盘尺寸与丝印标注可提高贴装良率与焊接可靠性；0402 封装对贴片机精度与锡膏印刷要求较高。
四、可靠性与测试
该系列厚膜电阻在常规可靠性验证中表现良好，适用于焊接热循环、机械振动与一般潮湿环境。建议在关键应用中结合具体的环境应力测试（如热循环、湿热、机械冲击）以验证在目标使用条件下的长期可靠性。
五、典型应用场景
- 便携式消费电子：体积受限的电源分压、偏置与限流网络。
- 通信与工控设备：阻值精度与温度稳定性要求中等的信号调理与分流电路。
- 汽车电子（非安全关键回路）：在合适的温度和验证前提下可用于辅助电路。
- 大规模贴装生产：适合自动贴装与回流/波峰焊流程的批量生产。
六、包装与订购提示
型号：0402WGF221JTCE，品牌 UniOhm（台湾厚声）。订购时请确认阻值、精度与封装号，并索取厂方推荐的 PCB 焊盘图与回流曲线。存放时避免潮气与强酸碱环境，出货前按规范进行外观与阻值抽检以确保一致性。
总结：0402WGF221JTCE 以其小尺寸、高密度贴装兼容性、良好温度范围和可靠性，适用于追求体积与成本优化的电子产品设计中，尤其在标准电阻网络与一般功率要求不高的场合表现优异。
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