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UniOhm 0402WGF1911TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 0402WGF1911TCE
- Type
- UNIOHM
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNIOHM
- Electronic Component
- 0402WGF1911TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 1.91kΩ
- Electronic Component
- 50
- Electronic Component
- BM0263512308
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF1911TCE 产品概述
一、产品概要
0402WGF1911TCE 是 UniOhm（台湾厚声）系列的 0402 封装厚膜固定电阻，阻值 1.91 kΩ，精度 ±1%，额定功率 62.5 mW，最大工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ 至 +155℃。该器件以稳定的温漂和紧凑尺寸为特点，适用于体积受限但对精度与温度稳定性有一定要求的电子产品中。
二、主要参数
- 电阻类型：厚膜电阻（SMT）
- 阻值：1.91 kΩ
- 精度：±1%
- 额定功率：62.5 mW（0402 标准额定）
- 最大工作电压：50 V
- 温度系数：±100 ppm/℃
- 工作温度：-55℃ ~ +155℃
- 封装规格：0402（适配 SMT 自动贴装）
三、特点与优势
- 高密度封装：0402 尺寸有利于产品小型化与高密度布板。
- 精度与稳定性：±1% 精度配合 ±100 ppm/℃ 的温漂，适合对阻值稳定性有要求的模拟与数字电路。
- 宽温度范围：适用于工业级温区与军工门槛以下的多数应用环境。
- 兼容 SMT 工艺：适配常规卷带贴装与回流焊工艺，便于自动化生产。
四、典型应用
- 移动设备与可穿戴终端的分压、偏置网络
- 精密模拟电路与滤波器网络
- 通信设备、仪器仪表中的信号处理与测量通道
- 工业控制、消费电子中对体积和可靠性有要求的场合
五、使用与安装建议
- 焊接：建议采用符合 J-STD-020 的无铅回流焊工艺；控制预热和峰值温度，避免重复高温循环。
- 布局：参考 IPC 推荐的 0402 焊盘设计并保证良好焊接强度；避免在器件两端形成不均匀热沉。
- 功率与散热：在高环境温度下需按设计要求进行功率降额处理，避免长时间满载工作导致热耦合问题。
- 测量：常规阻值测量可采用两端测量；要求更高精度时可采用温度稳定测量环境。
六、可靠性与品质控制
UniOhm 台湾厚声产品通过严格的制造与筛选工艺，满足常见的环境与机械可靠性试验要求（如温度循环、湿热、机械冲击等）。出厂前通常进行阻值、外观与焊接性检验，保证可追溯性与批次稳定性。
七、包装与订购信息
标准供应方式为卷带（Tape & Reel），适配 SMT 自动化贴装。订购时请指明完整料号 0402WGF1911TCE、所需数量与包装规格，以便确认交期与库存。
八、注意事项
- 请勿超出标称最大工作电压 50 V，以防瞬态击穿或长期漂移。
- 在高湿或腐蚀性气氛中应采取防护措施，避免焊接残留物长期侵蚀。
- 对关键电路建议在样机阶段进行实际环境和寿命验证。
如需更详细的等效电路参数、回流焊推荐曲线或 PCB 焊盘建议图，请提供具体的应用环境与制造流程，以便给出针对性的工程建议。
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