WMSIC Electronic Components

UniOhm 0603WAF1104T5E

Model0603WAF1104T5E
Package0603
BrandUNIOHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Uni Ohm 0603WAF1104T5E
Type
UNIOHM
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNIOHM
Electronic Component
0603WAF1104T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
1.1MΩ
Electronic Component
10
Electronic Component
BM0259483127
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF1104T5E 产品概述

一、产品简介

0603WAF1104T5E 为 UniOhm(台湾厚声)出品的厚膜贴片电阻,封装为 0603(约 1.6 × 0.8 mm),标称阻值 1.1MΩ,阻值精度 ±1%,额定功率 100 mW,最大工作电压 75 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该型号属于高阻值、小封装、通用型厚膜电阻,适用于占位受限且需高阻值的电子电路。

二、主要电气特性及意义

  • 阻值 1.1MΩ:适用于高阻抗偏置、上拉/下拉电路、漏电流极低的分压、滤波与采样前置电路等场景。
  • 精度 ±1%:在高阻值应用中可保证较好的分压精度与配对稳定性,减少后续校准负担。
  • 额定功率 100 mW 与最大工作电压 75 V:在实际设计时应同时满足功率与电压限制,若电压接近 75 V,应避免将功率计算仅基于 P=V^2/R,而以厂家规定的工作电压为准。
  • TCR ±100 ppm/℃:温度变化对阻值的影响约为每 ℃ ±0.01%,对高阻值精度要求高的电路需要考虑温漂补偿或温度控制。
  • 工作温度 -55℃~+155℃:适合工业级与宽温环境工作要求。

三、性能优点与局限

优点:

  • 小尺寸(0603)便于高密度 PCB 设计。
  • ±1% 精度与较小 TCR 满足多数高阻值偏置与分压需求。
  • 厚膜工艺成本较低,产能稳定,适合量产。

局限:

  • 厚膜电阻相比金属膜在噪声与长期稳定性上略逊一筹,湿热条件下需注意表面泄漏与阻值漂移。
  • 最高工作电压 75 V 对部分高压应用有局限,若需更高电压应选高压专用电阻或增加串联。

四、应用场景

  • 模拟输入偏置电阻、放大器栅极/基极偏置电阻
  • 高阻值分压器、ADC 前端阻抗设定
  • 采样电路、传感器信号链中的上拉/下拉电阻
  • 低功耗电路中需要小漏电与高阻隔离的场合

五、PCB 布局与可靠性建议

  • 遵循厂家推荐的焊盘与回流工艺,避免过度热应力;常规 0603 可兼容标准回流曲线。
  • 对于接近 75 V 的应用,应在 PCB 设计上保留足够爬电距离与组件间隔,防止表面闪络。
  • 在湿热或带盐雾环境下,建议采用涂覆保护(如 conformal coat)或选用更高可靠性封装。
  • 高阻值电路应注意清洁处理,避免焊膏残留或污染引起泄漏电流而影响性能。

六、选型与使用注意

  • 生产与采购时以厂家数据手册为准,核对阻值、精度、温漂与环境等级。
  • 电路设计中同时考虑功率与额定工作电压的双重限制,并在高温下按厂家降额曲线处理。
  • 如对噪声、长期稳定性或高湿环境有更高要求,建议评估金属膜或薄膜电阻替代方案。

如需完整规格书、温度/功率降额曲线或推荐的 PCB 焊盘尺寸,可提供进一步索取 UniOhm 官方数据手册的信息,我可协助对照与解读。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.