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UniOhm 201007F2701T4E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 201007F2701T4E
- Type
- UNIOHM
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- 750mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNIOHM
- Electronic Component
- 201007F2701T4E
- Electronic Component
- 1
- Package
- 2010
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.046g
- Electronic Component
- 2.7kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264743683
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
201007F2701T4E — UniOhm（台湾厚声）2010 2.7kΩ ±1% 厚膜电阻（750mW） 产品概述
一、产品简介
201007F2701T4E 为 UniOhm（台湾厚声）推出的 2010 封装厚膜片式电阻，标称阻值 2.7kΩ，精度 ±1%，额定功率 750mW，额定工作电压 200V。体积小、质量轻，专为贴片自动化组装设计，既可通过回流焊也可承受波峰焊工艺，适用于中高可靠性和温度范围宽的电子设备。
二、主要电气参数
- 电阻类型：厚膜电阻
- 阻值：2.7kΩ（2700Ω）
- 精度：±1%（F）
- 额定功率：750mW（静态额定）
- 最高工作电压：200V
- 温度系数（TCR）：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：2010（适配常规贴片机）
三、尺寸与封装优势
2010 封装在兼顾占板面积和功率散热能力方面具有良好平衡。小尺寸带来重量与体积双重优势，可有效降低装配与运输成本。封装工艺保证与主流贴片机、回流焊和波峰焊流程兼容，便于高速量产环境下的稳定贴装与焊接。
四、工艺与使用建议
- 焊接：适用于常规回流焊温区及波峰焊，建议遵循厂商指定的回流曲线以避免过热应力。
- 功率管理：在高环境温度下须按热降额规则使用，确保结温在安全范围内；实际电流与功耗应考虑额定功率余量以提升可靠性。
- 布局：焊盘及热散设计应利于热量传导，避免在高功率密集区集中放置大量功率器件。
- 机械应力：避免在封装边缘施加过大弯曲或拉伸力，焊盘设计与贴装工艺需减小机械应力传递。
五、典型应用场景
适合于电源管理电路、信号调理、测量与检测模块、通讯设备、工业控制以及要求较宽温度范围和稳定性的消费电子产品。特别适用于需要贴片化、波峰/回流双工艺兼容以及中等功率耗散场合。
六、可靠性与环境适应
- 宽温工作范围（-55℃ ~ +155℃）适应工业级与部分苛刻环境。
- ±100ppm/℃ 的温漂特性在大多数通用电子设计中可保持良好阻值稳定性。
建议在关键应用中参考厂商寿命试验与湿热、冲击、振动等可靠性数据，以满足长期稳定性要求。
七、选型与采购提示
在选型时，除阻值与精度外，请关注电路中的最大瞬态电压、散热条件与实际工作环境温度，必要时考虑升档功率或并联/串联方案以提升余量。订购时使用完整料号（201007F2701T4E）与确认封装、卷带规格可加快交付与贴装兼容性确认。若需更详细的热降额曲线、回流曲线或可靠性数据，建议向 UniOhm 厂商或代理索取正式数据手册。
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