WMSIC Electronic Components

UniOhm 0603WAF1023T5E

Model0603WAF1023T5E
Package0603
BrandUNIOHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Uni Ohm 0603WAF1023T5E
Type
UNIOHM
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNIOHM
Electronic Component
0603WAF1023T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
102kΩ
Electronic Component
10
Electronic Component
BM0257576079
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF1023T5E 产品概述

一、产品简介

0603WAF1023T5E 为 UniOhm(台湾厚声)出品的厚膜贴片电阻,封装尺寸为 0603(1.6 mm × 0.8 mm,英制 0.06" × 0.03"),标称阻值 102kΩ(1023 碼表示 102 × 10^3 Ω),精度 ±1%,额定功率 100 mW。该系列属于经济型厚膜电阻,适合大批量应用与常规电子线路的表面贴装需求。

二、主要参数

  • 电阻类型:厚膜电阻
  • 标称阻值:102 kΩ(1023)
  • 阻值精度:±1%
  • 额定功率:100 mW(0.1 W)
  • 允许工作电压:75 V(最大工作电压)
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0603(1.6 × 0.8 mm)
  • 品牌:UniOhm 台湾厚声

三、特点与优势

  • 成本效益高:厚膜工艺适合中低成本、大批量生产,单颗成本低,性价比高。
  • 小尺寸高密度:0603 尺寸利于高密度 PCB 设计,节省板面空间。
  • 稳定的基准性能:±1% 精度适合多数模拟与数字电路的常规分流、拉高/拉低、偏置网络。
  • 宽温度适应性:工作温度覆盖 -55 ℃ 到 +155 ℃,可满足多种环境条件。
  • 适用高阻值场合:102 kΩ 适合偏置、电压分压、高阻抗信号处理和功耗受限的电路设计。

四、典型应用

  • 电压分压、偏置与拉高/拉低电阻
  • 模拟前端与传感器采集电路中的高阻抗网络
  • 通信设备、家电和消费电子器件中常规阻值需求
  • 计时、电路漏电流控制与滤波网络
  • 需要较小封装和一般精度的轻载电路

五、封装与电气、热性能注意事项

  • 额定功率 100 mW 为在标准环境温度(通常 70 ℃ 或室温下)给出的最大散热值。实际应用中需考虑功率随环境温度的降额(derating)。常见做法是:在 70 ℃ 以上按线性方式降额,在最高工作温度附近接近 0 W(具体降额曲线以厂方资料为准)。
  • 最大工作电压 75 V 为器件两端允许的最高直流电压,超出该值可能导致击穿或绝缘退化。高阻值电路在含有脉冲或瞬态过电压时也要谨慎选型。
  • TCR ±100 ppm/℃ 表明阻值随温度变化的幅度,长短期精度要求更高或温漂更严的场合建议选用薄膜或金属膜更低 TCR 的产品。

六、焊接与存储建议

  • 焊接兼容无铅回流:建议采用标准无铅回流工艺,峰值温度一般以不超过 260 ℃ 且在高温区达到的时间尽量短为原则(以 IPC/JEDEC 推荐回流曲线为参照)。
  • 焊盘设计:遵循厂商推荐的焊盘尺寸与过孔/热舱布局,避免过量焊锡导致焊点应力和热应力集中。
  • 储存:未使用元件建议保持原包装,避免潮湿、高温及腐蚀性气体环境;贴片卷带应按制造商规定的方式保存以保证可靠性。

七、可靠性与质量标准

  • 厚膜电阻具备常规的耐温、耐湿和机械冲击性能,适用于工业与民用电子设备的长期使用。
  • 常见可靠性测试包括:高温贮存、温度循环、湿热、机械冲击与振动、焊接热稳定性等。具体通过的认证或测试报告请向 UniOhm 厂方或代理索取,以满足专业或关键应用的认证要求(如需 AEC-Q200 等汽车级资质,请确认厂商是否有相应型号)。

八、选型建议与替代方案

  • 若电路对温漂和噪声敏感(精密测量、低噪放大器、参考源等),建议考虑 TCR 更低(如 ±25 至 ±50 ppm/℃)的薄膜或金属膜电阻。
  • 若需要更高功率或更高工作电压,可选更大封装(0805、1206 等)或专用高压电阻器。
  • 采购建议:大批量采购前建议索取样品并在目标电路中完成热性能和长期稳定性验证。

如需更详尽的电气曲线、封装尺寸图、回流曲线或可靠性试验数据,可联系供应商获取完整数据表(Datasheet)与最小起订量、包装方式信息。

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