Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UniOhm 0603WAF8251T5E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 0603WAF8251T5E
- Type
- UNIOHM
- Minimum package
- 5000 卷
Technical parameters
- Power
- 100mW
- Electronic Component
- UNIOHM
- Electronic Component
- 0603WAF8251T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 8.25kΩ
- Electronic Component
- 10
- Electronic Component
- BM0259364052
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF8251T5E 产品概述
一、产品简介
0603WAF8251T5E 为 UniOhm（台湾厚声）系列厚膜片式电阻，阻值 8.25 kΩ，精度 ±1%，额定功率 100 mW，封装为业界通用的 0603（1608公制）尺寸。该型号以稳定的电阻特性、良好的温度稳定性与适用于表面贴装工艺的可靠性为特点，适合精密模拟电路与高密度装配场景。
二、主要规格
- 电阻类型：厚膜电阻
- 阻值：8.25 kΩ
- 精度：±1%（F）
- 额定功率：100 mW（室温，按封装及环境条件）
- 最大工作电压：75 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0603（1608 公制）
- 品牌：UniOhm（台湾厚声）
三、特点与优势
- 精度优良：±1% 精度满足多数精密信号链、分压与反馈网络需求。
- 温度稳定性合理：±100 ppm/℃ 的 TCR 在中高精度应用中能保证阻值漂移受控。
- 小尺寸高密度：0603 尺寸利于高密度 PCB 设计与自动化贴装。
- 耐环境能力强：宽温区工作（-55 ℃～+155 ℃），适应工业级环境。
- 表面贴装兼容：适用于无铅回流焊等标准 SMT 工艺。
四、典型应用场景
适用于便携式消费电子、通讯设备、测量仪器、传感器前端、模拟放大器的偏置/分压网络、电源监控与阻值校准等需要中高精度小型电阻的场合。
五、可靠性与使用建议
- 在高温环境下应考虑功率降额；若长期在高温工作，建议留有功率裕量。
- 避免在超过最大工作电压的条件下使用，以免引起电阻失效或绝缘破坏。
- 对于高可靠性设计，可进行合适的温度循环与湿热试验验证。
六、封装与焊接建议
- 推荐采用标准 SMT 回流焊工艺，遵循元件制造商的回流温度曲线。
- 为避免机械应力，贴装时应控制焊盘设计与焊膏量，回流后避免强力弯曲 PCB。
- 烘烤与潮湿控制：如长期暴露在潮湿环境，参考元件的防潮存储要求进行预烘烤处理。
七、订购与注意事项
订购时请确认阻值与精度代码、包装方式（卷带/盘装）与批次。如用于关键应用，建议索取器件规格书与可靠性测试报告，并与供应商确认是否符合具体的环境与寿命要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
