Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UniOhm 0603WAF1332T5E Resistor 0603WAF1332T5E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Uni Ohm 0603WAF1332T5E
- Type
- UNIOHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNIOHM
- Electronic Component
- 0603WAF1332T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 13.3kΩ
- Electronic Component
- 10
- Electronic Component
- BM0259483129
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF1332T5E 产品概述
一、产品简介
0603WAF1332T5E 为 UniOhm（台湾厚声）系列厚膜贴片电阻，封装尺寸为 0603（1608 公制），阻值 13.3kΩ，精度 ±1%，额定功率 100mW，最高工作电压 75V，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃ ～ +155℃。该器件定位通用精密厚膜电阻，适用于体积受限且对稳定性有中等要求的电子产品。
二、主要参数与性能特点
- 阻值：13.3kΩ，公差 ±1%，适合精度要求较高的分压、偏置和反馈电路。
- 功率与电压：额定功率 100mW，最大工作电压 75V；高温环境下需按厂方降额曲线进行热功率降额。
- 温漂：±100ppm/℃（即 0.01%/℃），举例：温度升高 100℃ 时电阻变化约 1%，在温度敏感电路中应考虑温度补偿或选用温漂更低的产品。
- 结构与材料：厚膜工艺，成本效益高，焊接性良好；相较薄膜/金属膜在噪声和长期漂移方面略逊，但符合多数消费及工业类应用需求。
- 工作温度：-55℃ 至 +155℃，适应较宽温度范围，需关注高温下的长期可靠性。
三、典型应用场景
- 移动设备、消费电子中的分压与偏置网络；
- 工业控制与仪表的信号处理前端（非高精度量测）；
- 通讯设备的偏置、电流检测（受限于功率和脉冲能力）；
- PCB 空间受限处的通用电阻替换。
四、可靠性与焊接建议
- 焊接：推荐使用工业标准回流焊工艺，遵循元件制造商及 IPC/JEDEC 的回流温度曲线，避免过度热冲击与频繁的重流；良好焊盘设计和焊膏量有助于热传导与机械强度。
- 降额建议：在环境温度上升时按厂商提供的降额曲线执行，通常在 25℃ 时为额定功率，随着温度上升线性降额直至最高允许温度。
- 防护与存储：避免长期潮湿和机械应力，运输和贴装时注意勿弯曲 PCB 导致元件应力集中。厚膜电阻对脉冲能量和过载敏感，禁止超过规定的瞬态电压/功率以免产生开路或漂移。
五、选型与替代方案
- 若对温漂或噪声有更高要求，建议选用薄膜或金属薄膜电阻（TCR 更低、噪声更小）；
- 若需更高功率或更强脉冲能力，考虑 0805/1206 等更大封装的同系列产品；
- 采购时请索取完整数据表确认负载寿命、湿热测试、冲击与振动等具体指标，需汽车级请确认是否有 AEC‑Q200 认证版本。
六、包装与订购注意事项
常见包装形式为带卷（Tape & Reel），订购或样品申请时请确认包装数量、生产批次与数据手册。型号示例：0603WAF1332T5E（表述封装、系列与阻值精度），如需个性化测试或长期供货协议，可与供应商确认出货与质量保证条款。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
