WMSIC Electronic Components

VBsemi FDC637AN-VB FDC637AN

ModelFDC637AN-VB
PackageTSOP-6
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi FDC637AN-VB
Type
VBSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
FDC637AN-VB
Electronic Component
1
Package
TSOP-6
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.051g
Electronic Component
1
Electronic Component
BM0266060555
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.3W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FDC637AN-VB N沟道MOS场效应管产品概述

一、产品基本信息

FDC637AN-VB是VBsemi微碧半导体推出的N沟道增强型MOS场效应管,采用TSOP-6-1.5mm紧凑封装(引脚间距1.5mm),专为低压、中小电流的电子应用场景设计。作为一款性价比突出的MOSFET,它兼顾了低导通损耗、平衡的开关特性和小体积优势,广泛适配便携设备、电源管理等领域的需求。

二、核心电参数特性

这款MOS管的关键参数针对性强,能满足多数低压应用的核心需求:

  1. 低导通损耗:导通电阻RDS(on)仅23mΩ(Vgs=10V时)——这是其核心优势之一,低导通电阻意味着大电流通过时管压降小、功耗低,例如在电池供电的负载开关中,可有效减少能量损耗,延长设备续航。
  2. 开关特性平衡:栅极电荷量Qg=4.2nC(Vgs=10V),输入电容Ciss=424pF(Vgs=15V),反向传输电容Crss=42pF(Vgs=15V)。这些参数既避免了超高速MOS的高驱动成本,又能满足普通DC-DC转换器、负载开关的开关速度需求,平衡了性能与设计复杂度。
  3. 电压电流范围适配:漏源电压Vdss=30V,连续漏极电流Id=5.5A,覆盖了5V、12V等常见低压系统的应用场景,峰值电流(通常可达连续电流的2-3倍)可应对瞬时负载波动。
  4. 低阈值电压兼容:栅源阈值电压Vgs(th)=1.5V,无需额外栅极驱动电路,可直接兼容3.3V、5V的MCU GPIO控制,简化电路设计。

三、封装与典型应用场景

TSOP-6-1.5mm封装的尺寸优势(比传统SOT-23-6更紧凑)使其成为空间受限场景的优选,典型应用包括:

  • 便携电子设备:手机、平板、可穿戴设备的电源管理(电池充放电控制、负载开关);
  • 低压电源模块:12V转5V、5V转3.3V等DC-DC转换器的同步整流管;
  • 小功率负载驱动:LED背光驱动、小型电机(如玩具电机)的开关控制;
  • 电池保护电路:锂离子电池的过充/过放保护(配合专用保护IC)。

四、可靠性与环境适应性

FDC637AN-VB的可靠性参数贴合工业级与消费级需求:

  • 宽温工作范围:-55℃~+150℃,可应对极端低温(如户外便携设备)和高温(如密闭电源模块)环境;
  • 热性能适配:最大耗散功率Pd=1.3W,在连续5.5A电流下,实际功耗仅≈0.7W(I×R=5.5A×23mΩ),远低于额定值,只需PCB适当铺铜即可满足散热需求,无需额外散热片。

五、选型与使用注意事项

  1. 控制电压优化:为获得最优导通电阻,建议Vgs设置在10V左右(参数最优值);若用3.3V控制,导通电阻会升高,需根据应用需求平衡损耗与驱动成本;
  2. 静电防护:MOS管栅极易被静电击穿,存储、焊接时需使用防静电手环、工作台,避免直接接触引脚;
  3. 驱动能力匹配:栅极电容Ciss=424pF,MCU驱动时可并联100Ω左右的电阻,优化开关速度与损耗;
  4. 封装焊接要求:TSOP-6-1.5mm封装适合自动化贴片,手工焊接需注意温度(建议≤260℃,时间≤3秒),避免损坏器件。

总结

FDC637AN-VB是一款针对低压中小功率应用优化的N沟道MOSFET,在低导通损耗、平衡开关特性、小体积封装上表现突出,适配消费电子、便携设备等场景的需求,是替代同类产品的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.