Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WILLSEMI WS72551EA-5/TR WS72551EA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WILLSEMI WS72551EA-5 / TR
- Type
- WILLSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WILLSEMI
- Electronic Component
- WS72551EA-5/TR
- Electronic Component
- 1
- Package
- SOT-23-5L
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.054g
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Electronic Component
- Electronic Component
- BM0227309670
- Operating Temperature
- 40℃~+125℃
- Amplifier
- 1
- Output Current
- 20mA
- (SR)
- 1.2V/us
- Power Supply Voltage
- 2.5V~5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WS72551EA-5/TR 产品概述
一、简介
WS72551EA-5/TR 是韦尔（WILLSEMI）推出的一款单路零温漂运算放大器（chopper-stabilized），面向高精度直流测量与传感器接口。器件具有极低输入失调（Vos=14µV）和极低失调漂移（Vos TC=8nV/℃），配合140dB 的共模抑制比和极低噪声密度（eN=80nV/√Hz@1kHz），非常适合要求长期稳定与高分辨率的系统。
二、主要特点
- 零温漂架构，极低失调与漂移（Vos=14µV，Vos TC=8nV/℃）。
- 超高共模抑制比：CMRR = 140dB，差分信号抗干扰能力强。
- 低噪声：eN = 80nV/√Hz（1kHz），适合微弱信号放大。
- 轨到轨输入/输出（Rail-to-Rail），支持接近电源轨的信号处理。
- 宽工作电源范围：单电源 2.5V ~ 5V，最大电源差 5V。
- 低输入偏置电流 Ib = 10pA、输入失调电流 Ios = 4pA，适合高阻源。
- 增益带宽积 GBP = 1.7MHz，压摆率 SR = 1.2V/µs，静态电流 Iq = 235µA。
- 单路输出电流可达 20mA，封装为 SOT-23-5L，工作温度 -40℃ ～ +125℃。
三、典型应用
- 精密传感器前端：称重传感器、桥式压力/力传感器的差分测量与放大。
- 低频、高精度数据采集：电压基线跟踪、电位器/电阻应变桥接口。
- 便携仪表与电池供电设备：2.5V~5V 单电源工作、低功耗特性适合移动设备。
- 精密滤波与缓冲：作为 ADC 驱动或低通滤波器中的低漂移缓冲放大器。
- 低漏电要求场合：高阻输入测量、化学传感、电流检测（配合跨阻放大器拓扑）。
四、设计与使用要点
- 电源去耦：建议在靠近芯片的 VDD–VSS 带 0.1µF 陶瓷去耦电容以抑制供电纹波。
- 输入布局：由于输入偏置电流仅为 pA 级，须采用防潮和低泄漏 PCB 材料，避免杂散电流和焊剂残留影响精度；必要时使用 guarding 技术。
- 输出驱动与带载：器件可提供最高约 20mA 输出电流，但在驱动低阻负载或大容性负载时需注意稳定性与压摆限制。
- 带宽与相位裕度：GBP 1.7MHz 与 SR 1.2V/µs 说明器件适合低频精密应用；对高增益或高速切换应用需评估相位裕度与增益设置。
- 抗寄生电容：输入节点尽量缩短走线，减少寄生电容对零漂和噪声的影响。
- 温度与长期稳定：零温漂架构能显著降低温度引起的偏移漂移，但在极端环境下仍建议作系统级校准以保证长期精度。
五、封装与可靠性
WS72551EA-5/TR 提供 SOT-23-5L 小外形封装，便于空间受限的 PCB 布局和自动化贴装。器件工作温度范围 -40℃ 至 +125℃，满足工业级可靠性需求。静态工作电流约 235µA，在便携与工业控制间取得平衡，综合性能优异，适合要求高精度、低漂移的各类测量与控制系统。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
