WMSIC Electronic Components

WILLSEMI ESD56051N-2/TR ESD56051N

ModelESD56051N-2/TR
PackageDFN1006-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD56051N-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD56051N-2/TR
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
75pF
Electronic Component
BM0230483411
Operating Temperature
40℃~+85℃
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD56051N-2/TR 产品概述

一、产品简介

ESD56051N-2/TR 是 WILLSEMI(韦尔)推出的一款单路双向瞬态抑制器(ESD保护器件),以小封装、高能量吸收能力和低漏电为设计亮点。该器件针对 3.3V 工作电压等级的接口保护优化,能有效钳位并吸收静电放电(ESD)、电快速瞬变(EFT)和浪涌(Surge)脉冲,满足 IEC 61000-4-2/4-4/4-5 等抗扰度标准。

二、主要性能参数

  • 钳位电压(Vc):10 V(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 击穿电压(Vbr):3.6 V
  • 反向截止电压(Vrwm):3.3 V
  • 峰值脉冲功率(Ppp):550 W(8/20 μs)
  • 峰值脉冲电流(Ipp):55 A(8/20 μs)
  • 反向电流(Ir):100 nA(典型)
  • 结电容(Cj):75 pF
  • 通道数:单路;极性:双向
  • 类型:ESD 保护二极管
  • 封装:DFN1006-2L(超小贴片封装)
  • 认证/防护等级:符合 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5

三、关键特性与优势

  • 高能量吸收:550 W(8/20 μs)峰值功率和 55 A 峰值电流,可有效吸收大能量瞬态脉冲,适合工业及消费类电子的电磁兼容(EMC)防护需求。
  • 低夹断电压:在高脉冲电流下典型钳位电压约 10 V,能在保护被保护电路的同时降低瞬态过压风险。
  • 低漏电流:100 nA 的低反向漏流,有利于在待机或低功耗电路中使用,避免影响电平或待机功耗。
  • 小封装:DFN1006-2L 封装占板面积小,适用于空间受限的移动终端、模块化设计和多通道保护布局。
  • 双向保护:可对双向或差分信号进行保护,无需外加反相器件,适合交流或双向数据线保护。

四、典型应用场景

  • 3.3V 电平的接口保护(GPIO、UART、I2C、SPI 等)
  • 通信接口与控制线的 ESD/EFT 抗扰设计
  • 工业控制、仪表与传感器接口防护
  • 小型模块与移动设备中对空间和功耗有要求的保护位置
    注意:由于结电容约 75 pF,器件对高速差分信号(如高速 USB、HDMI、PCIe 等)可能产生信号损耗或影响眼图,设计时应评估带宽影响。

五、封装与布局建议

  • 将器件尽量靠近被保护引脚焊接,缩短 PCB 引线长度以提高防护效果。
  • 使用稳固的接地回流路径,靠近保护器件设置地铜箔或多层接地层。
  • 对于频繁受击或高能量环境,考虑在保护器件与系统地之间增加熔断器或串联阻抗以分担能量。
  • DFN1006-2L 小封装在回流焊工艺下表现良好,注意按照厂家推荐的 PCB 焊盘尺寸与回流曲线。

六、选型与注意事项

  • 确认工作电压与 Vrwm(3.3 V)匹配,避免在更高直流总线电压下长期工作。
  • 如需保护超高速信号,应优先选择低电容型保护器件;若可接受 75 pF,则 ESD56051N-2/TR 为性价比良好的选择。
  • 在高温或持续冲击环境下,评估器件热耗散与 PCB 散热能力,必要时进行热仿真验证。

七、总结

ESD56051N-2/TR 以其高功率吸收能力、低漏电及小封装特性,适用于 3.3V 级别的单路双向接口防护,能满足 IEC 常见抗扰度标准。设计时需权衡结电容对信号完整性的影响,并按照封装与 PCB 布局建议进行落板以获得最佳防护效果。若需更详细的电气特性曲线、封装尺寸图与推荐焊盘,请参考 WILLSEMI 官方数据手册或联系供应商获取。

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