WMSIC Electronic Components

WILLSEMI WL2815D33-4/TR WL2815D33

ModelWL2815D33-4/TR
PackageXDFN-4-EP(1x1)
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WL2815D33-4 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
230mV@(300mA)
Electronic Component
WILLSEMI
Electronic Component
50uVrms
Electronic Component
WL2815D33-4/TR
Electronic Component
1
Package
XDFN-4-EP(1x1)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.005g
Electronic Component
1
Features
Output
Electronic Component
BM0227309667
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WL2815D33-4/TR 产品概述

一、产品简介

WL2815D33-4/TR 是 WILLSEMI(韦尔)推出的一款超低静态电流线性稳压器,提供固定的 3.3V 输出,最大输出电流 300mA。器件采用微型 XDFN-4-EP (1×1 mm) 封装,适合对尺寸和功耗有严格要求的便携式与物联网终端应用。该器件在常见 100Hz 工频干扰下具有良好的电源纹波抑制(PSRR 65dB),并集成短路保护,可靠性高。

二、主要性能亮点

  • 输出类型:固定 3.3V 输出
  • 最大工作电压:5.5V(器件适用于最高输入电压至 5.5V)
  • 最大输出电流:300mA
  • 典型压差(Dropout):230mV @ 300mA,适用于低压差场景
  • 静态电流(Iq):仅 1.5µA,极低待机功耗,利于电池供电系统
  • 输出噪声:50µVrms(低噪声特性)
  • PSRR:65dB @ 100Hz(良好抑制低频电源纹波)
  • 保护功能:内部短路/过流保护
  • 工作温度范围:-40°C ~ +85°C(Ta)

三、封装与热管理

WL2815D33-4/TR 采用 XDFN-4-EP 小尺寸封装(1×1 mm),带露铜散热焊盘。尽管封装非常小巧,但通过在 PCB 上设计合适的焊盘和多层铜/热盲孔或热通孔,可以有效提升热耗散能力。建议:

  • 露铜焊盘与器件底部热焊盘充分焊接;
  • 在焊盘周围布置热过孔并连至内层/底层散热平面;
  • 在高功率工况下考虑适当降额使用,以保证结温在安全范围内。

四、典型应用场景

  • 电池供电的物联网节点、传感器模块
  • 可穿戴设备与便携式仪表
  • MCU、Bluetooth/Wi‑Fi/LTE 前端供电
  • 工业控制和消费类电子低功耗子电源

五、设计与使用建议

  • 输入/输出电容:推荐在器件输入端靠近 VIN 引脚放置 1µF4.7µF 的陶瓷电容以稳定输入,输出端建议使用 1µF10µF 低 ESR 陶瓷电容以保证稳定性与瞬态响应(具体容量需参考系统负载与稳定性测试)。
  • 布线:Vin、GND、Vout 走线尽可能短且粗,地线尽量采用单点或连续平面,输出负载回流路径要低阻抗。
  • 启动与瞬态:在大电流瞬态场合,适当增大输出电容或在输出端并联陶瓷与钽/固态电容,以改善瞬态跌落和抑制振铃。
  • 热保护与降额:当环境温度较高或持续大电流输出时,应关注器件结温,必要时采用散热设计或限制连续输出电流以延长寿命。

六、可靠性与封装注意事项

  • 焊接工艺应遵循 XDFN 系列的回流焊规范,露铜焊盘需充分助焊,避免空焊。
  • 存储与回流温度应遵循器件数据手册推荐范围,避免超温造成性能退化。
  • 器件具备短路保护,但频繁触发保护会影响长期可靠性,应在系统层面避免持续短路或过载。

七、结语

WL2815D33-4/TR 以其超低静态电流、低压差与低噪声特性,结合小尺寸封装和短路保护,非常适合空间受限且对功耗敏感的应用场景。在实际设计中,合理的 PCB 热设计和输入/输出电容选择是保证性能与可靠性的重要环节。若需具体电气参数曲线、推荐 PCB 封装孔位或典型应用电路图,请参阅 WILLSEMI 官方数据手册或联系供应商获取详尽资料。

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