WMSIC Electronic Components

WILLSEMI WD3136E-6/TR WD3136E

ModelWD3136E-6/TR
PackageSOT-23-6L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WD3136E-6 / TR
Type
WILLSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WD3136E-6/TR
Electronic Component
1
Package
SOT-23-6L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.047g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0228747272
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.4V~20V
Switching Frequency
800kHz~1.2MHz
Electronic Component
Electronic Component
Output Voltage
2.4V~24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WD3136E-6/TR 产品概述

一、产品简介

WD3136E-6/TR 是 WILLSEMI(韦尔)推出的一款升压型 DC-DC 开关稳压器,采用升压拓扑、内置开关管、非同步整流设计,适用于对输出可调且需较大输出电流的便携与工业应用。器件工作电压范围宽(2.4V~20V),工作结温范围为 -40℃ 至 +125℃(TJ),开关频率高达 800kHz~1.2MHz,从而利于采用小体积磁性与输入/输出电容实现紧凑方案。

二、主要参数

  • 输出类型:可调
  • 拓扑:升压(Boost)
  • 开关管:内置(集成功率开关)
  • 同步整流:否(需外置肖特基二极管)
  • 输入电压范围:2.4V ~ 20V
  • 输出电流:最高 3A(负载能力)
  • 静态电流 Iq:约 250µA(轻载下低静态消耗)
  • 开关频率:800kHz ~ 1.2MHz
  • 输出通道:单通道
  • 工作温度:-40℃ ~ +125℃(TJ)
  • 封装:SOT-23-6L
  • 型号:WD3136E-6/TR

三、产品特色与应用场景

  • 低待机电流(Iq≈250µA),适合电池供电设备以延长待机时间;
  • 支持宽输入电压,可直接由单节或多节电池、铅酸或12V系统升压到所需电压;
  • 高频开关利于减小电感与电容体积,适合便携终端、消费电子、便携测量设备、便携式通信与小型电源模块等场景;
  • 非同步整流要求外部肖特基二极管,但在高输出电流场合可简化驱动与成本。

四、设计建议与注意事项

  • 由于为非同步整流,请选用低正向压降肖特基二极管,尤其在高电流(接近3A)时以降低功耗与发热;
  • 电感与二极管电流额定值应大于最大负载电流并考虑峰值裕量;建议按实际占空比与纹波电流计算所需电感值与饱和电流;
  • 高频开关要求合理布局:输入旁路电容尽量靠近芯片 VIN 与 GND 引脚,开关节点(SW)与电感、二极管走线短且粗,减小 EMI 与环路电感;
  • 热管理:在高负载下芯片与外部器件会产生热量,应评估 PCB 铜箔散热面积与过孔,必要时使用散热铜箔或外壳散热;
  • 参考厂商数据手册获取软启动、保护(如过流、过温、欠压锁定)阈值与具体典型应用电路,以确保稳定与可靠。

五、封装与采购

WD3136E-6/TR 采用 SOT-23-6L 小封装,便于空间受限的板级集成。量产与样片采购请通过 WILLSEMI 官方或授权分销渠道,详细技术参数、典型电路、波形与 PCB 布局示意请以厂家数据手册为准。

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