WMSIC Electronic Components

WINSOK WSD4038DN33

ModelWSD4038DN33
PackageDFN-8(3x3)
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSD4038DN33
Type
WINSOK
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSD4038DN33
Electronic Component
1
Package
DFN-8(3x3)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.129g
Electronic Component
1
Electronic Component
BM0264549095
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.1W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSD4038DN33 产品概述

一、产品简介

WSD4038DN33 是微硕(WINSOK)推出的一款高性能沟槽型 N 沟道 MOSFET,额定漏源电压为 40V,适用于中低压同步降压转换器与功率开关应用。器件采用 DFN-8 (3×3 mm) 紧凑封装,具有高单元密度和较低导通电阻,兼顾导通损耗与开关性能,适合对效率与封装面积有严格要求的电源方案。

二、关键参数

  • 类型:N 沟道 MOSFET
  • 漏源耐压 Vdss:40V
  • 连续漏极电流 Id:38A(封装与散热条件相关)
  • 导通电阻 RDS(on):13 mΩ @ VGS=10V
  • 阈值电压 VGS(th):2.5V
  • 总栅极电荷 Qg:28nC @ VGS=10V(影响开关损耗)
  • 输入电容 Ciss:1.125nF;输出电容 Coss:132pF;反向传输电容 Crss:70pF
  • 功耗 Pd:2.1W(在规定散热条件下)
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:DFN-8 (3×3)

三、主要特性

  • 低 RDS(on) 与高电流能力:13mΩ@10V 在小封装下提供较低导通损耗,适合高密度电源设计。
  • 平衡的开关性能:Qg=28nC 与较小的 Crss(70pF)在高速开关时可兼顾开关损耗与栅极驱动需求。
  • 小体积、高可靠性:DFN-8(3×3) 封装节省 PCB 面积,器件通过 100% 环境应力筛选(EAS),适合量产可靠性要求。
  • 环保合规:符合 RoHS 与绿色产品要求。

四、典型应用场景

  • 同步降压(Buck)转换器主开关/低侧开关
  • 服务器与通信电源模块的点对点供电
  • 车载电子(12V/24V 较低电压域)及工业电源(受限于 40V 最大电压)
  • 电机驱动前端开关与高频开关电源

五、设计与布局建议

  • 驱动电压:为获得标称 RDS(on),推荐栅压 VGS=10V;若使用 5V 驱动,需评估导通电阻上升与损耗增大。
  • 栅极驱动布局:栅极走线尽量短、粗,靠近驱动源放置去耦电容与阻尼网络以抑制振铃。
  • 散热处理:DFN 封装需借助大面积铜箔与过孔导热至内层或底层散热,确保器件在高电流下温升可控,以发挥 38A 能力与 2.1W 功耗条件。
  • 保护与吸收:在高速开关环境下,Crss 导致的 Miller 效应需在驱动设计中考虑,可在必要时增加 Rg 或 RC 吸收网络减小瞬态尖峰。
  • PCB 着焊:中心热焊盘应充分焊接,保证机械与热连接,避免虚焊影响热阻与可靠性。

六、可靠性与选型提示

WSD4038DN33 针对同步开关电源场景做了性能优化,兼顾导通损耗与开关特性。选型时应根据实际工作电压、开关频率和散热条件综合评估:在高频且频繁开关的系统中需权衡 Qg 导致的驱动损耗;在大电流持续工作时需重点考虑 PCB 散热方案和结温限制。若工作电压或能量脉冲更高,可考虑更高 Vdss 规格的器件。

总结:WSD4038DN33 在 40V/38A 的等级上,以 13mΩ 的低导通电阻与适中的栅极电荷提供了良好的能效与封装密度,适合空间受限且对效率有较高要求的同步降压与功率开关应用。

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