WMSIC Electronic Components

WINSOK WSD50P10ADN56

ModelWSD50P10ADN56
PackageDFN5X6-8L
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSD50P10ADN56
Type
WINSOK
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSD50P10ADN56
Electronic Component
1
Package
DFN5X6-8L
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.132g
Electronic Component
1
Electronic Component
BM0265577383
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
104W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSD50P10ADN56 P沟道场效应管产品概述

一、产品基本定位

WSD50P10ADN56是WINSOK微硕推出的一款P沟道增强型MOSFET,采用DFN5X6-8L封装(尺寸5mm×6mm),属于中低压大电流功率器件范畴。该产品以高功率密度、低导通损耗为核心特点,适配工业控制、电源转换、电机驱动等多场景,同时具备宽温工作能力,可满足极端环境下的稳定运行需求。

二、核心电气参数解析

作为功率MOSFET,关键参数直接决定其应用边界,以下是核心参数的实用解读:

2.1 电压与电流额定值

  • 漏源击穿电压(Vdss):100V:明确了器件关断状态下可承受的最大漏源电压,适用于100V以内的中低压电路,避免过压击穿风险。
  • 连续漏极电流(Id):40A:25℃环境下,封装长期稳定承载的漏极电流(需配合散热设计),能满足中小功率电机、电源开关等场景的电流需求。

2.2 导通与驱动特性

  • 导通电阻(RDS(on)):81mΩ@10V:栅源电压(Vgs)为10V时的导通电阻,属于低阻水平——低RDS(on)意味着导通功率损耗(I²R)小,可显著提升系统效率(如DC-DC变换器的转换效率)。
  • 阈值电压(Vgs(th)):2.5V:器件开始导通的栅源电压门槛,通常驱动电压需≥4V(1.5倍阈值)以保证可靠导通,适配常见驱动芯片(如IR2104、TLP281等)的输出能力。

2.3 开关与电容特性

  • 栅极总电荷(Qg):75nC@10V:反映栅极驱动所需的电荷量,数值适中——既不会因Qg过大导致驱动损耗过高,也能保证一定的开关速度(适合几十kHz至几百kHz的中等频率应用)。
  • 输入电容(Ciss=2.59nF)、反向传输电容(Crss=45pF)、输出电容(Coss=320pF):电容参数影响开关损耗与噪声,Ciss较低利于快速充放电,Crss较小可减少米勒效应带来的开关振荡,整体开关特性平衡了速度与损耗。

2.4 功率与温度范围

  • 耗散功率(Pd):104W:封装可承受的最大功耗(需配合PCB散热设计),实际应用中需通过铜箔面积、散热片等方式降低结温,避免过热失效。
  • 工作温度:-55℃~+150℃:宽温范围覆盖工业级(-40℃+85℃)、部分车载场景(-40℃+125℃),可适应极端环境下的长期运行。

三、封装与散热设计

WSD50P10ADN56采用DFN5X6-8L无引脚扁平封装,具备以下优势:

  1. 小体积高密度:5mm×6mm的封装尺寸,比传统TO-252封装缩小约60%,适合紧凑PCB设计(如便携设备、车载控制器)。
  2. 低热阻散热:DFN封装通过焊盘直接与PCB铜箔接触,热阻远低于有引脚封装——若PCB上设计大面积散热焊盘(如10mm×10mm以上铜箔),可有效将结温控制在150℃以内,保障大电流下的稳定性。
  3. 引脚兼容性:8L封装布局合理,适配常规SMT贴装工艺,批量生产效率高。

四、典型应用场景

结合参数特点,WSD50P10ADN56的核心应用场景包括:

  1. 中低压DC-DC变换器:如12V/24V转5V的降压电路(P沟道作为高端开关)、电池升压电路(如无人机电池3S转12V),低导通损耗提升转换效率。
  2. 电机驱动电路:小型直流电机、步进电机的H桥驱动(如工业机器人关节、智能家电电机),40A电流满足扭矩需求,宽温适应车间环境。
  3. 车载电源开关:车载电子设备(如导航、行车记录仪)的电源通断控制,100V耐压覆盖车载12V/24V系统,宽温适配-40℃低温启动与高温暴晒。
  4. 电池管理系统(BMS):锂电池组的过充/过放保护开关,低RDS(on)减少充放电损耗,宽温适应户外储能设备(如太阳能储能电池)。

五、产品优势总结

相较于同规格竞品,WSD50P10ADN56的核心优势在于:

  • 功率密度突出:小封装承载40A/104W,适合高密度设计;
  • 效率表现优异:81mΩ低导通电阻,降低系统功耗;
  • 环境适应性强:-55℃~+150℃宽温,覆盖工业/车载场景;
  • 开关特性平衡:适中的Qg与电容参数,兼顾速度与损耗;
  • 品牌可靠性:WINSOK微硕的工业级品质,适合批量应用。

该器件可作为中低压大电流场景的可靠选择,满足从消费电子到工业控制的多样化需求。

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