WMSIC Electronic Components

WINSOK WSF40N10A

ModelWSF40N10A
PackageTO-252
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSF40N10A
Type
WINSOK
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSF40N10A
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.56g
Electronic Component
1
Electronic Component
BM0257411998
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
52.1W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSF40N10A 产品概述

WSF40N10A 是微硕(WINSOK)推出的一款高耐压、低导通损耗的 N 沟场效应管(MOSFET),封装为TO-252(DPAK),适用于中功率开关与电源管理场景。器件以 100V 的耐压能力和 31A 的连续漏极电流为基础,兼顾导通电阻与开关性能,适合开关电源、马达驱动及负载开关等应用。

一、主要参数一览

  • 类型:N 沟道 MOSFET(单个)
  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:31 A
  • 导通电阻 RDS(on):55 mΩ @ Vgs = 10 V
  • 耗散功率 Pd:52.1 W
  • 阈值电压 Vgs(th):2.5 V
  • 总栅极电荷 Qg:22 nC @ Vgs = 10 V
  • 输入电容 Ciss:3.84 nF
  • 输出电容 Coss:115 pF
  • 反向传输电容 Crss:80 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:TO-252(DPAK)
  • 品牌:WINSOK(微硕)

二、性能特点与优势

  • 高耐压设计(100V):可应对较高电压的转换与逆变场合,适合汽车电子、工业电源与离散逆变器等需要较高耐压的场景。
  • 较低导通电阻(55 mΩ@10V):在 10V 驱动下具有较小的导通损耗,适合需要高效率的低端导通开关或同步整流应用。
  • 合理的栅极电荷与电容:Qg = 22 nC 与 Ciss = 3.84 nF 表示器件在开关时需一定驱动能量,既能保证开关速度,又利于控制 EMI 与振铃。
  • 小型表面贴装封装(TO-252):适合自动贴片工艺及中功率 PCB 散热设计,便于体积受限的应用。

三、典型应用场景

  • 同步整流与降压转换器(Buck)
  • 电机驱动与功率开关(低中功率马达)
  • 电源管理:DC-DC 转换、逆变器前端开关
  • 负载开关与电池管理系统(BMS)中的开断元件
  • 工业控制与消费类电源模块

四、使用与设计注意事项

  • 驱动电压:为达到标称 RDS(on),建议使用 Vgs = 10 V 的栅极驱动电压;若仅以逻辑电平(如 5 V)驱动,导通电阻将显著增大,需评估损耗。
  • 开关损耗与栅极驱动:Qg = 22 nC 意味着在高频开关时需要合适的驱动器来快速充放电栅极,以降低开关过渡损耗和发热。驱动器选型应考虑驱动能力与驱动源阻抗。
  • 热管理:器件 Pd = 52.1 W 为器件在理想散热条件下的耗散能力,实际应用中需结合 PCB 铜箔面积、过孔和散热片设计以保证结温在安全范围内。
  • 布局建议:在高频开关电路中,尽量减小栅极-源极回路与漏极-源极回路的环路面积,靠近器件放置退耦电容,减小 EMI 与振铃风险。
  • 可靠性与环境:器件工作温度范围宽(-55 ℃~+150 ℃),适合工业等级应用,但长期高温运行会加速电阻升高与老化,宜控制结温。

五、封装与选型提示

  • TO-252(DPAK)表面贴装形式,适合自动化焊接与中等功率 PCB 散热方案。选型时应根据实际散热条件、开关频率与导通/开关损耗综合评估是否满足系统需求。
  • 若系统需要更低的导通损耗或更高的开关频率,可考虑 RDS(on) 更低或 Qg 更小的替代品;若工作电压低于 100V,可选用更低 Vdss 的器件以获得更佳性能/成本比。

WSF40N10A 以其平衡的耐压、电流能力和封装形式,为中功率电子设计提供了可靠的开关元件选择。在设计时合理配置栅极驱动与散热布局,能发挥其在效率与稳定性上的优势。

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