WMSIC Electronic Components

WINSOK WSF15P10

ModelWSF15P10
PackageTO-252
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSF15P10
Type
WINSOK
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSF15P10
Electronic Component
1
Package
TO-252
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.475g
Electronic Component
1
Electronic Component
BM0264498692
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
50W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSF15P10 P沟道场效应管(MOSFET)产品概述

WSF15P10是WINSOK(微硕)推出的一款中功率P沟道增强型MOSFET,针对100V低压中功率场景优化,平衡了导通损耗、开关速度与功率容量,适用于电源管理、开关控制等核心环节。

一、产品核心定位与应用场景

WSF15P10的参数覆盖100V电压范围、13A连续电流,属于中功率低压P沟道MOSFET,主要面向以下典型场景:

  • 消费电子电源:笔记本电脑、显示器等设备的电源适配器同步整流(低端开关);
  • 车载电子:12V/24V车载DC-DC转换器、车载充电接口控制;
  • 电池管理:多串锂电池组(≤100V)的过充/过放保护开关;
  • 小型电机驱动:100V以内直流电机的正反转控制、调速电路;
  • LED驱动:中功率LED电源的PWM调光开关、恒流输出控制。

二、关键电气参数深度解析

核心参数直接决定应用适配性,关键指标解析如下:

  1. 漏源电压(Vdss):100V
    无栅极驱动时漏源间最大允许反向电压,确保≤100V电路中安全工作,避免反向击穿。
  2. 连续漏极电流(Id):13A
    结温25℃时的最大连续电流,实际需结温降额(如150℃时电流约为额定值1/3)。
  3. 导通电阻(RDS(on)):190mΩ@10V Vgs、5.5A Id
    导通状态等效电阻,是导通损耗核心指标。190mΩ低阻值可显著降低损耗(如5A电流时损耗仅4.75W),提升电路效率。
  4. 耗散功率(Pd):50W
    结温25℃时最大允许功率,需结合封装热阻计算实际功率(TO-252封装结到环境热阻约50℃/W,25℃环境下最大耗散约2W,需PCB散热提升)。
  5. 阈值电压(Vgs(th)):4V@250uA
    栅源电压使漏极电流达250uA的电压,确保5V以上驱动电压可靠导通,避免驱动不足导致损耗增大。
  6. 电容特性
    • 输入电容(Ciss):600pF,影响栅极驱动电流需求;
    • 反向传输电容(Crss):34pF,降低米勒效应,减少开关电压过冲;
    • 输出电容(Coss):60pF,影响关断时电压上升速度。

三、封装与热特性说明

采用TO-252(DPAK)封装,具备以下优势:

  • 尺寸紧凑:典型尺寸6.5mm×5.0mm×1.6mm,适合贴片焊接,节省PCB空间;
  • 散热优化:底部金属片可直接连接PCB铜箔,扩展散热焊盘(如10mm×10mm铜箔)可有效降低结温;
  • 工艺兼容:符合无铅焊接标准,兼容回流焊、波峰焊,适合自动化生产。

四、栅极特性与开关性能

栅极特性平衡了开关速度与驱动功耗:

  • 栅极电荷量(Qg):13.7nC@10V Vgs
    驱动总电荷小,可采用低成本驱动IC(10V驱动时平均电流仅约137nA);
  • 开关速度:低Crss+小Qg使开关延迟<100ns,适合PWM调光、电机调速等快速切换场景。

五、可靠性与环境适应性

满足工业级可靠性要求:

  • 温度范围:-55℃+150℃,覆盖车载(-40℃+85℃)、户外电源(-20℃~+60℃)等高低温环境;
  • ESD防护:符合HBM≥2kV、MM≥200V标准,降低生产/使用损坏风险;
  • 环保合规:无铅封装,符合RoHS指令,满足绿色制造需求。

六、应用设计注意事项

  1. 散热设计:预留足够散热焊盘,避免结温超150℃;
  2. 驱动电路:栅极驱动电压≥5V,驱动电阻10Ω~100Ω(平衡速度与噪声);
  3. 过冲防护:漏源并联100V/1A TVS管,抑制开关电压过冲。

总结

WSF15P10凭借低导通损耗、快开关速度、宽温度范围与紧凑封装,成为100V以内中功率P沟道应用的高性价比选择,覆盖消费电子、车载、电池管理等多领域。

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