WMSIC Electronic Components

WINBOND W25Q256JVFIQ

ModelW25Q256JVFIQ
PackageSOIC-16-300mil
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W25Q256JVFIQ
Type
WINBOND
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25Q256JVFIQ
Electronic Component
1
Package
SOIC-16-300mil
Electronic Component
NOR FLASH
Electronic Component
0.814g
Electronic Component
1
Features
positions; Power Supply
Electronic Component
BM0247693439
Electronic Component
256Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
10uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W25Q256JVFIQ 产品概述

一、产品简介

W25Q256JVFIQ 是 WINBOND(华邦)推出的一款 256Mbit(32M x 8)Flash NOR 存储器,采用标准 SPI 接口并支持 Quad I/O 模式,器件最高工作时钟可达 133MHz。器件工作电压范围为 2.7V 至 3.6V,提供工业级工作温度范围(-40°C ~ +85°C),以满足嵌入式系统、消费类电子和工业控制等场景对容量、速度与可靠性的综合需求。封装为 SOIC-16(300mil),便于通过孔或表面贴装电路设计。

二、主要性能参数

  • 存储容量:256Mbit(32M x 8)
  • 接口类型:SPI(支持四线 Quad I/O)
  • 最高时钟频率:133MHz
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:典型 10 μA(省电待机模式)
  • 擦写寿命:100,000 次
  • 数据保存(TDR):20 年
  • 工作温度:-40°C ~ +85°C
  • 封装:SOIC-16-300mil

三、功能与特性亮点

  • 高密度存储:256Mbit 提供足够容量用于固件、代码、文件系统或媒体数据存储。
  • 高速访问:133MHz 时钟配合 Quad I/O 有效提高读写带宽,缩短启动和数据加载时间。
  • 低功耗:待机电流仅约 10 μA,利于电池供电或低功耗系统设计。
  • 高可靠性:支持 100k 次擦写循环和 20 年数据保持,适合长期部署应用。
  • 工业温度等级:-40°C ~ +85°C,满足严苛环境下的稳定运行需求。

四、典型应用场景

  • MCU/CPU 的代码存储与执行(XIP/Execute-in-Place)
  • 嵌入式系统固件与引导程序(Boot ROM/BIOS)
  • 消费类电子设备的配置信息和多媒体数据存储
  • 工业控制、通信设备的参数和日志记录

五、设计与使用建议

  • 电源去耦:靠近 VCC 引脚放置 0.1 μF 陶瓷去耦电容,保证在高速 SPI 读写时电源稳定。
  • 引脚保护:对 WP、HOLD 等控制引脚采用上拉/下拉策略(按系统需求),避免未定义状态导致写保护或挂起。
  • 时序兼容:在启用 Quad I/O 或高速模式时,确认主控支持相应的命令和时序,必要时参考厂商应用手册调整延时。
  • 擦写管理:合理规划扇区/块擦写策略,配合磨损均衡和文件系统层面的错误管理,以延长寿命。
  • 热设计:在高温或散热受限的环境下,关注器件功耗与热沉路径,确保工作温度在额定范围内。

六、采购与替代建议

W25Q256JVFIQ 因其高密度、高速和工业级温度特性,适合对容量与稳定性有较高要求的项目。在采购时注意型号完整性(封装、工作电压与温度等级),并可用其他同容量且支持 Quad SPI 的 NOR Flash 作为替代,但需验证引脚兼容性和命令集的差异以降低软件适配成本。

如需更详细的引脚说明、时序图和命令集说明,请参考 WINBOND 正式技术资料或联系供应商获取最新数据手册。

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