WMSIC Electronic Components

WINBOND W25Q32JVSNIQ

ModelW25Q32JVSNIQ
PackageSOIC-8-150mil
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W25Q32JVSNIQ
Type
WINBOND
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25Q32JVSNIQ
Electronic Component
1
Package
SOIC-8-150mil
Electronic Component
NOR FLASH
Electronic Component
0.204g
Electronic Component
1
Electronic Component
BM0211615945
Electronic Component
32Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
10uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
133MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WINBOND W25Q32JVSNIQ 串行NOR Flash产品概述

一、核心定位与品牌背景

W25Q32JVSNIQ是华邦电子(WINBOND)推出的串行NOR Flash存储芯片,针对嵌入式系统中对高容量、高速传输、低功耗的需求场景设计。华邦作为全球知名存储方案供应商,在NOR Flash领域拥有成熟的设计制造经验,产品以可靠性高、兼容性强、成本效益优著称,广泛覆盖消费电子、工业控制、物联网等领域。W25Q32JVSNIQ继承了华邦NOR Flash系列的核心优势,为中小规模存储需求提供了性能与成本平衡的解决方案。

二、存储核心参数

作为32Mbit容量的串行NOR Flash,其核心参数精准匹配嵌入式系统的关键需求:

  • 容量规格:32Mbit(即4M字节,通过4M×8位存储阵列实现),可满足固件存储、数据日志、配置参数等中小规模存储需求;
  • 电压范围:工作电压支持2.7V~3.6V,兼容主流3V/3.3V嵌入式系统供电,无需额外电平转换;
  • 低功耗特性:待机电流仅10μA,在电池供电的便携设备中可显著延长续航时间;
  • 擦写性能:擦写寿命达100,000次(10万次),支持页写入(单页时间3ms)与块擦除(64KB块擦除时间150ms),平衡写入速度与存储单元寿命。

三、接口与性能特性

W25Q32JVSNIQ采用SPI串行接口,并向下兼容Dual SPI(双SPI)与Quad SPI(四SPI),大幅提升传输效率:

  • 时钟频率:最高支持133MHz时钟速率,配合Quad SPI模式可实现理论532Mbps传输带宽(133MHz×4位并行传输),比普通SPI快4倍;
  • 访问速度:典型访问时间仅6ns,可快速响应MCU读指令,缩短系统启动与数据读取延迟;
  • 接口兼容性:支持标准SPI协议(Mode 0/3),无需复杂硬件适配,可直接对接主流MCU(如STM32、ATmega等)。

四、可靠性与环境适应性

产品的可靠性与环境适应性是嵌入式应用的核心考量,W25Q32JVSNIQ表现优异:

  • 数据保留:数据可稳定保留20年,满足长期存储配置参数、固件等关键数据的需求;
  • 宽温范围:工作温度覆盖-40℃~+85℃,可适应工业级环境(户外传感器、工厂PLC)与消费电子极端场景(高温下的智能家居设备);
  • 擦写稳定性:10万次擦写寿命结合20年数据保留,确保长期使用中无数据丢失或性能下降。

五、封装与典型应用场景

W25Q32JVSNIQ采用SOIC-8-150mil封装(8引脚小外形集成电路,引脚间距150mil),体积紧凑,适合空间受限设计,典型应用包括:

  • 消费电子:智能穿戴(手表、耳机)、智能家居终端(开关、传感器);
  • 工业控制:PLC模块、工业传感器节点、远程监控设备;
  • 物联网终端:低功耗IoT节点(环境监测、智能门锁);
  • 汽车电子:车载辅助系统(胎压监测、车载显示);
  • 固件存储:MCU外部固件扩展(替代内部Flash,提升容量)。

六、产品优势总结

W25Q32JVSNIQ凭借高容量(32Mbit)、高速SPI接口(133MHz/Quad SPI)、低功耗(10μA待机)、宽温可靠性(-40~85℃) 等核心优势,成为嵌入式系统中小容量存储的理想选择。华邦品牌品质保障+紧凑SOIC-8封装,使其在多领域具有广泛适配性,可有效满足不同场景的存储需求。

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