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WINBOND W25Q40CLSNIG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WINBOND W25Q40CLSNIG
- Type
- WINBOND
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WINBOND
- Electronic Component
- W25Q40CLSNIG
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- NOR FLASH
- Electronic Component
- 0.435g
- Electronic Component
- 1
- Electronic Component
- BM0257658583
- Electronic Component
- 4Mbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.3V~3.6V
- Current
- 10uA
- Interface Type
- SPI
- Electronic Component
- 100000
- Clock Frequency(fc)
- 104MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W25Q40CLSNIG 产品概述
W25Q40CLSNIG 是 WINBOND（华邦）推出的一款 4Mbit SPI NOR Flash 存储器（512K x 8），采用 SOIC-8 封装，面向嵌入式系统、工业控制与消费类电子的代码存储与数据保存应用。器件支持最高 104MHz 的 SPI 时钟，工作电压范围宽（2.3V~3.6V），在低功耗与可靠性之间取得平衡，适用于对启动代码、配置数据和固件升级有可靠性要求的场景。
一、主要规格
- 存储容量：4 Mbit（512K x 8）
- 接口类型：SPI（最高 104 MHz）
- 工作电压：2.3 V ~ 3.6 V
- 工作温度：-40 ℃ ~ +85 ℃
- 待机电流：典型 10 μA
- 擦写寿命：100,000 次（典型）
- 数据保留（TDR）：20 年
- 页写入时间（Tpp）：400 μs（典型）
- 块擦除时间（tBE）：150 ms @ 64 KB（典型）
- 封装：SOIC-8
二、功能亮点
- 支持标准 SPI 读写以及快速读取模式，系统启动与执行代码读取响应快；
- 宽电压范围与低待机电流，适合电池供电与低功耗系统；
- 高耐用性与长数据保留，满足工业级长期可靠性需求；
- 小封装、占板面积小，利于空间受限的终端设备设计。
三、典型应用
- MCU/SoC 引导与固件存储（Boot ROM、BIOS）
- 工业控制器、智能仪表和仪器的参数/配置存储
- 物联网节点、智能家居与消费电子设备的固件与数据保存
- 可编程模块与外设固件升级存储
四、设计建议
- 电源引脚旁放置合适的退耦电容（例如 0.1 μF）以抑制瞬态噪声；
- SPI 总线保持良好走线、减少阻抗和串扰，尤其在 104 MHz 工作下；
- 在需要防止误写场合，使用器件的写保护/保持管脚（若设计有）并配置外部上/下拉；
- 布局时留意 SOIC-8 引脚散热与焊盘尺寸，保证可靠焊接与在线测量方便。
W25Q40CLSNIG 以其成熟的 NOR Flash 架构、工业级温度与长期数据保持能力，适合作为需要稳定、可重复擦写与长期保存数据的嵌入式存储解决方案。若需参考电气特性曲线或命令集与时序细节，请查阅 WINBOND 官方数据手册以获得完整规范与典型应用方案。
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