WMSIC Electronic Components

WINBOND W25N04KVZEIR

ModelW25N04KVZEIR
PackageWSON-8(6x8)
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W25N04KVZEIR
Type
WINBOND
Minimum package
480 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25N04KVZEIR
Electronic Component
1
Package
WSON-8(6x8)
Electronic Component
NAND FLASH
Electronic Component
0.08g
Electronic Component
1
Features
OTP and; ECC; positions
Electronic Component
BM0263568014
Electronic Component
4Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
20uA
Interface Type
SPI
Electronic Component
6

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W25N04KVZEIR 产品概述

W25N04KVZEIR 是华邦(WINBOND)推出的一款 4G-bit 串行 NAND 闪存器件,面向嵌入式、消费电子和工业应用场景。器件采用 SPI 串行接口,工作电压约为 3V(2.7V~3.6V),并以小尺寸封装(WSON-8,6x8 mm)提供高密度存储解决方案。该器件在读写性能、可靠性和安全防护上进行了优化,适合对尺寸、功耗和系统资源有严格要求的设计。

一 主要规格

  • 存储容量:4 Gbit(NAND 结构,串行访问)
  • 接口类型:SPI 串行接口
  • 最大时钟频率 (fc):104 MHz
  • 工作电压:2.7V ~ 3.6V(典型 3.0V)
  • 页写入时间 (Tpp):250 μs(典型)
  • 块擦除时间 (tBE):10 ms(典型)
  • 数据保留 (TDR):10 年
  • 擦写寿命(P/E cycles):60,000 次
  • 工作温度范围:-40℃ ~ +85℃
  • 待机电流:20 μA(典型)
  • 封装:WSON-8(6 mm × 8 mm)

二 功能亮点

  • 硬件写保护:支持物理层的写保护功能,有助于防止误写或软件层失效时的数据破坏。
  • 读缓存功能:内置读缓存以提高连续读取效率,减少外部主机访问次数。
  • OTP 区域写保护与锁定:支持 1 次可编程(OTP)区域,并提供写保护与锁定机制,适合存放不可变配置或安全密钥。
  • ECC 硬件纠错:内置纠错(ECC)机制,可在器件内部进行位错误校正,提升数据完整性与系统可靠性。
  • 软件复位功能:提供软件复位命令,便于系统在异常情况下恢复设备到已知状态。
  • 写使能锁存与软件写保护:支持写使能锁存(WEL)和片上软件写保护功能,提供多层写入控制策略。

三 性能与功耗

W25N04KVZEIR 的 SPI 接口在 104 MHz 时钟下可提供较高的串行吞吐能力,适合固件存储、启动镜像及频繁读取的场景。页写入时间 250 μs 与块擦除时间 10 ms 表明在写入或擦除大块数据时需关注主机调度与延时管理。待机电流典型为 20 μA,有利于电池供电或低功耗嵌入式系统的待机能耗优化。

设计时建议:

  • 在高频访问下做好电源旁路与 PCB 布局,降低噪声对数据传输和 ECC 的影响。
  • 合理安排写入与擦除策略,避免频繁大范围擦写以延长寿命。

四 可靠性与数据保护

器件提供 6 万次擦写寿命与 10 年的数据保留能力,适合长期部署的工业级应用。内置 ECC 可纠正常见的位翻转错误,结合 OTP 和硬件写保护、软件写保护机制,为重要数据提供多重防护。设计中还应考虑上层的磨损均衡(wear leveling)、坏块管理与冗余机制,以进一步提升系统级可靠性。

五 封装与物料信息

W25N04KVZEIR 提供 WSON-8(6x8 mm)小尺寸封装,适合空间受限的 PCB 设计。小封装结合 SPI 串行接口的低引脚数特性,便于在紧凑型设备(例如智能终端、嵌入式控制器、物联网节点)中实现高密度存储方案。具体封装引脚分配与热管理建议请参阅完整数据手册。

六 典型应用与设计注意事项

典型应用场景:

  • 启动存储(Boot ROM / BIOS / Bootloader)
  • 固件与配置数据存储
  • 嵌入式系统和物联网设备的非易失性存储
  • 消费电子与智能终端的资源文件存储(图像、音频片段、参数等)

设计注意事项:

  • 请参考官方数据手册获取完整的命令时序、引脚说明与寄存器定义,特别是关于写保护、复位与 OTP 锁定的操作流程。
  • 在支持高可靠性的系统中,结合上层软件实现磨损均衡、坏块管理和数据冗余,以发挥器件的最大寿命与数据完整性。
  • 确保电源滤波与时钟完整性,避免在高频工作时造成数据传输错误。
  • 对于安全关键应用,合理利用 OTP 区域与写保护机制防止未经授权的写入。

总结:W25N04KVZEIR 将 4G-bit 串行 NAND 的高密度存储、低引脚接口和多重数据保护机制融合于小尺寸封装,适合对体积、功耗与可靠性有要求的嵌入式与消费类产品。在产品设计初期,应结合数据手册进行时序、电源和软件层面的集成验证,以确保系统稳定可靠运行。

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