WMSIC Electronic Components

WINBOND W9864G6KH-6 W9864G6KH

ModelW9864G6KH-6
Package54-TSOP II
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W9864G6KH-6
Type
WINBOND
Minimum package
864 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W9864G6KH-6
Electronic Component
1
Package
54-TSOP II
Electronic Component
SDRAM
Electronic Component
2.01g
Electronic Component
1
Features
Clock Synchronous
Electronic Component
BM0264213757
Electronic Component
64Mbit
Operating Temperature
0℃~+70℃
Operating Voltage
3V~3.6V
Clock Frequency(fc)
166MHz
Electronic Component
Electronic Component
Electronic Component
864

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W9864G6KH-6 SDRAM 产品概述

一、核心参数总览

W9864G6KH-6是华邦(WINBOND)推出的商业级高速同步动态随机存取存储器(SDRAM),核心参数清晰适配中高速嵌入式系统需求:

  • 存储容量:64Mbit(换算为8MB有效存储空间),组织方式为4M×16位并行结构,直接匹配16位数据总线系统;
  • 性能指标:时钟频率166MHz,典型访问时间5ns,支持同步突发操作,数据读写与系统时钟同步;
  • 电气参数:工作电压范围3.0V~3.6V(典型值3.3V),符合主流嵌入式、消费电子供电标准;
  • 环境参数:工作温度0℃~+70℃(商业级),满足常规室内/便携设备应用;
  • 封装规格:54引脚TSOP II(薄型小外形封装),体积紧凑,便于PCB高密度布局。

二、关键性能特点

  1. 高速同步读写:采用同步时钟驱动,数据传输与系统时钟严格同步,避免异步器件的时序偏差,提升系统响应速度;
  2. 快速访问与突发模式:5ns访问时间与166MHz时钟完全匹配,支持突发长度(Burst Length)操作(如1/2/4/8突发),可连续读取相邻地址数据,减少地址译码开销;
  3. 低功耗设计:3.3V供电区间结合SDRAM的自动预充电、电源模式切换(待机/休眠),降低系统功耗,适合电池供电或功耗敏感设备;
  4. 数据可靠性:内置JEDEC标准刷新机制(64ms内完成1024次刷新),避免电容漏电导致的数据丢失,保证长期存储稳定性;
  5. 硬件兼容性:引脚定义遵循行业通用标准,可与同规格SDRAM直接替换,降低电路设计与项目切换成本。

三、封装与引脚说明

W9864G6KH-6采用54引脚TSOP II封装,具备以下实用特性:

  • 封装尺寸:典型规格14mm×20mm×1.2mm,厚度薄、体积小,适配小型化PCB设计;
  • 引脚分类:
    • 地址/控制引脚:包含行/列地址复用引脚(A0~A11)、时钟(CLK)、片选(CS#)、读写控制(WE#)等;
    • 数据引脚:16位双向数据总线(DQ0~DQ15),支持并行数据传输,提升单周期数据吞吐量;
    • 电源/地引脚:VDD(3.3V)、VSS(地)及参考电压引脚,保证供电稳定,减少噪声干扰;
  • 焊接兼容性:支持表面贴装工艺(SMT),适配常规回流焊流程,生产良率高。

四、典型应用场景

该器件凭借“中等容量+高速性能+紧凑封装”的组合,广泛覆盖以下领域:

  1. 消费电子:数码相框、便携式MP4/MP5、小型游戏机的主存缓存;
  2. 嵌入式系统:ARM7/ARM9核心板、单片机扩展存储、物联网网关的临时数据存储;
  3. 工业控制:小型PLC(可编程逻辑控制器)、数据采集模块的运算缓存;
  4. 通信设备:低速率路由器、交换机的数据包缓存、无线AP的临时数据存储。

五、华邦品牌选型优势

作为华邦成熟SDRAM产品线的一员,W9864G6KH-6具备显著选型优势:

  1. 稳定供货:华邦全球布局生产基地,产能稳定,可满足批量订单需求,避免缺货风险;
  2. 品质可靠:通过ISO 9001、ISO 14001认证,符合RoHS、REACH环保标准,产品一致性好;
  3. 技术支持完善:提供详细datasheet、应用笔记与参考设计,工程师可快速上手开发;
  4. 成本优势:性价比突出,在同规格竞品中具有竞争力,适合成本敏感型项目。

综上,W9864G6KH-6是一款适配中高速嵌入式系统的高性价比SDRAM,可满足消费电子、工业控制等多场景的存储需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.