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WINBOND W25Q64JWZPIQ
Configuration
1 options
Configuration
Option 175666
Availability on request
Technical data
Product details
20
specifications
Core information
- Product name
- WINBOND W25Q64JWZPIQ
- Type
- WINBOND
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- WINBOND
- Electronic Component
- W25Q64JWZPIQ
- Electronic Component
- 1
- Package
- 8-WSON（6x5）
- Electronic Component
- NOR FLASH
- Electronic Component
- 0.254g
- Electronic Component
- 1
- Electronic Component
- BM0264743777
- Electronic Component
- 64Mbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.7V~1.95V
- Interface Type
- SPI
- Electronic Component
- 100000
- Clock Frequency(fc)
- 133MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W25Q64JWZPIQ 产品概述
一、产品概览
W25Q64JWZPIQ 为 WINBOND（华邦）出品的 64Mbit 串行 SPI 闪存，容量等同于 8MByte，采用 1.8V 低电压工作范围（1.7V ~ 1.95V），适用于对功耗与电源空间有要求的嵌入式系统。封装为 8-WSON（6×5 mm），器件体积小、焊接可靠，便于移动和消费类电子设计布局。
二、主要规格
- 接口类型：SPI（兼容高速 SPI 操作，最高时钟频率 fc = 133 MHz）
- 存储容量：64 Mbit（8 MByte）
- 工作电压：1.7 V ～ 1.95 V（典型 1.8 V）
- 工作温度：-40 ℃ ～ +85 ℃
三、读写与擦写性能
- 页写入时间 Tpp（典型）：3 ms（单页编程）
- 块擦除时间 tBE（典型）：150 ms（基准块大小 64 KB）
- 擦写寿命：100,000 次（典型）
在高速 SPI 时钟下能满足快速代码与数据读取，写入/擦除建议按器件指令序列与时序规范执行以保证可靠性。
四、可靠性与数据保持
- 数据保持（TDR）：20 年（典型）
- 高耐久擦写次数与长期数据保持能力适合固件存储、参数记录与系统日志等嵌入式用途。为延长寿命建议采用分区与磨损均衡策略，重要数据可加入校验或 ECC 机制。
五、封装与机械特性
- 封装：8-WSON（尺寸 6×5 mm）
- 小型化、热性能和机械强度适合表面贴装工艺。推荐在布局中为 VCC 附近放置 0.1 μF 去耦电容，注意焊盘与过孔设计以保证热量分散与可焊性。
六、系统设计建议
- 电源与时钟：严格遵守 1.7–1.95 V 电源范围，避免上电/断电毛刺；SPI 时钟速率可达 133 MHz，但高速时注意 PCB 布线、阻抗匹配与终端策略。
- 控制信号：合理使用 CS、WP、HOLD（若有）引脚，确保写操作前正确发出 Write Enable。
- 软件策略：实现块/页操作时考虑擦写时间与忙标志（BUSY）查询，必要时使用后台擦除与固件升级流程。
七、典型应用
- 智能终端固件存储（MCU 程序、引导加载器）
- 消费类与便携式设备中大容量配置与日志保存
- 通信设备、工业控制中的非易失性参数存储
更多详细指令集与时序建议请参考 WINBOND 官方数据手册与应用说明，以便完成可靠的硬件与软件集成。
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