Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BH254V-10P是XFCN(兴飞) 推出的通用型IDC刺破式简牛座连接器,专为电子设备内部信号与小功率电源传输设计,凭借2.54mm标准间距、双排5Pin布局及宽温适配性,成为工业控制、仪器仪表等领域的高性价比选择。
作为兴飞XFCN系列连接器的经典型号,BH254V-10P属于简牛座(牛角座子类) ,采用IDC刺破式连接技术与直插插件封装,总Pin数10(2排×5Pin),核心定位为“中等密度、高适配性的通用内部连接器”——既满足常规电子设备的信号传输需求,又能承载小功率电源负载,适配多类PCB板与导线规格。
注:额定电流3A为单Pin典型值,实际总负载需结合导线规格与散热条件评估;工作温度范围符合工业级器件要求,可稳定运行于极端环境。
2.54mm是电子行业标准间距,BH254V-10P可直接匹配多数PCB板的通孔布局,无需额外改板;双排5Pin的10Pin总数量,既避免单排Pin数过多导致的焊接难度,又满足中等密度的信号/电源传输需求(如1路电源+9路信号,或2路电源+8路信号)。
直插插件式封装可直接焊接于PCB板通孔,操作简单;若搭配配套的IDC压接工具,可实现快速导线连接,无需复杂端子压接工序,适合批量生产与小批量定制。
PIN针采用优质黄铜材质(导电性能好、耐腐蚀),表面镀锡提升焊接性;塑料外壳采用耐高温工程塑料(匹配105℃工作温度),机械强度高,可承受多次插拔与振动(车载、工控设备振动环境)。
BH254V-10P适配多类电子设备,核心应用包括:
XFCN(兴飞)作为国内专业连接器制造商,拥有多年生产经验,BH254V-10P符合RoHS环保标准(无铅、无镉),并通过绝缘电阻、耐压等电气安全测试,确保质量稳定;同时提供技术咨询与定制服务,满足不同客户需求。
BH254V-10P简牛座凭借标准间距、宽温适配、安装便捷等优势,成为电子设备内部连接的高性价比选择,尤其适合工业控制、仪器仪表等对可靠性与兼容性有要求的场景。若需中等密度的信号/电源传输,该型号可作为优先考虑的连接器方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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