WMSIC Electronic Components

XFCN M2010V-02P M2010V

ModelM2010V-02P
PackageThrough-hole, P=2mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 177154

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M2010V-02P
Type
XFCN
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M2010V-02P
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.127g
Electronic Component
2mm
PIN
2P
Electronic Component
1
Electronic Component
BM0265157512
Electronic Component
PA
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃
Pin
1x2P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M2010V-02P线对板针座产品概述

M2010V-02P是兴飞(XFCN)品牌推出的一款小间距直插式线对板针座,针对紧凑空间内的电路连接需求设计,具备稳定的电气性能与可靠的环境适应性,适用于消费电子、工业控制等多领域的基础连接场景。

一、产品定位与基本形态

该产品属于单排针座系列,核心形态为1×2P(单排2Pin),间距2.0mm(行业通用小间距规格),采用直插式插件封装,通过PCB板过孔焊接实现固定与电气连接,整体设计紧凑,可有效节省设备内部空间。

二、核心规格参数明细

M2010V-02P的关键参数覆盖电气、机械、材料及环境维度,具体如下:

  • 电气性能:额定电流3A(满足常规低压小功率电路需求),额定电压250V(符合低压电气安全标准);
  • 机械结构:插针总PIN数2P(单排),Z轴板上高度6mm,Y轴板上底边宽度4.7mm(紧凑尺寸适配高密度PCB布局);
  • 材料特性:触头采用磷青铜(高导电、耐磨损、弹性佳),塑料主体为PA材质(耐冲击、成型性好),阻燃等级达UL94V-0(符合电子设备防火安全要求);
  • 环境适应性:工作温度范围-25℃~+85℃(覆盖常规室内及部分户外环境温度变化)。

三、关键性能与设计优势

  1. 电气可靠性突出
    磷青铜触头具备低接触电阻特性,可稳定传输电流与信号,避免电压降或信号衰减;3A额定电流满足多数小型设备(如智能家电、传感器模块)的功率需求,无需额外升级接口规格。

  2. 机械稳定性强
    直插式安装方式通过PCB过孔焊接固定,连接牢固不易松动;6mm的板上高度与4.7mm的底边宽度,可在有限空间内实现多针座并行布局,适配高密度电路设计。

  3. 环境与安全双重保障

    • 宽温工作范围(-25℃~+85℃)可适应不同季节、不同区域的环境温度变化,无需额外温控措施;
    • UL94V-0阻燃等级的PA塑料主体,可有效降低设备起火风险,符合电子行业安全规范。
  4. 耐用性表现优异
    磷青铜触头抗腐蚀、耐插拔(建议插拔次数≤500次),PA塑料主体耐冲击、不易开裂,可在长期使用中保持性能稳定,延长设备使用寿命。

四、典型应用场景

M2010V-02P的紧凑尺寸与可靠性能,使其适配以下场景:

  • 消费电子:小型家电(加湿器、智能台灯)、便携式设备(蓝牙耳机充电盒、移动电源)的内部电路连接;
  • 工业控制:微型传感器模块、MCU控制器的信号/电源接口;
  • 通信设备:小型路由器、交换机的辅助接口(如状态指示灯、复位按键连接);
  • 汽车电子:车载氛围灯控制器、小型辅助传感器(如胎压监测辅助模块)的低功率连接(适配车载常规工作温度范围)。

五、安装与使用注意事项

为确保产品性能与使用寿命,使用时需注意:

  1. 焊接规范:直插式安装需匹配PCB板过孔尺寸(需与针脚直径适配),焊接温度建议控制在260℃以下,单次焊接时间不超过10秒,避免高温损坏塑料主体;
  2. 存储条件:未使用产品需存储在干燥、通风环境中,存储温度-40℃~+60℃,湿度≤60%,避免阳光直射或接触腐蚀性气体;
  3. 插拔操作:避免过度插拔或倾斜插拔,防止触头变形导致接触不良;若需反复插拔,建议搭配配套的线端连接器使用。

综上,M2010V-02P凭借紧凑尺寸、可靠电气性能、阻燃安全特性及宽温适应性,成为小型电子设备线对板连接的高性价比优选器件,可满足多领域的基础连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.