Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XFCN PM200V-11-07-H43 PM200V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XFCN PM200V-11-07-H43
- Type
- XFCN
- Minimum package
- 43 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XFCN
- Electronic Component
- PM200V-11-07-H43
- Electronic Component
- 4.3mm
- Electronic Component
- 1
- Package
- Through-hole, P=2mm
- Electronic Component
- Electronic Component
- Electronic Component
- Female Header
- Electronic Component
- 0.46g
- Electronic Component
- 2mm
- Electronic Component
- 1
- Electronic Component
- BM0227384781
- Electronic Component
- Through-hole
- Operating Temperature
- 40℃~+105℃
- Electronic Component
- 7P
- Socket
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PM200V-11-07-H43 产品概述
一 产品简介
PM200V-11-07-H43 为 XFCN（兴飞）系列单排排母，直插式、1×7P 方孔设计，间距 2.00mm，塑高 4.3mm。该产品面向中低功率信号与弱电供电连接场景，结构紧凑、可靠性高，适合要求小间距、高密度布板的电子设备。
二 主要参数
- 排数：单排（1×7P）
- 总孔位数：7P（1x7）
- 间距（Pitch）：2.00mm
- 插孔结构：方孔，适配方形针脚或压插式端子
- 安装方式：直插（通孔/直插式）
- 插孔方向：顶部进入（顶插）
- 塑高：4.3mm
- 额定电流：2A（单针额定）
- 工作温度范围：-40℃ ~ +105℃
三 结构与材料
产品采用直插式塑料外壳与金属触点组合设计，外壳通常为耐高温工程塑料（符合工作温度），触点采用铜合金材料以保障导电性与机械寿命。方孔结构利于插拔定位，适配常见 2.0mm 间距公端（排针）配合使用。
四 电气与机械特性
额定电流 2A，适用于信号线与小电流电源线连接；工作温度范围满足常见工业与民用电子环境。方孔与直插方式提供稳固的插入力与脱插寿命，塑高 4.3mm 可以兼顾元件高度限制与可靠的接触空间。适当的表面处理（如镀锡）可根据应用环境提升抗氧化性和焊接性。
五 推荐应用场景
适用于通信设备、仪器仪表、工控模块、消费电子、LED 驱动板及 IoT 终端等场合，特别适合空间受限、需高密度连接的 PCB 布局。因额定电流与间距特性，也常被用作信号排线与测试接插件。
六 PCB 与焊接建议
- PCB 选型时预留通孔并保证良好焊盘面积与走线间隔以利焊接质量和力学支撑；
- 推荐采用手工焊接或波峰焊（按工艺评估），直插件需控制焊接温度与时间，避免塑料件过热变形；
- 焊后建议做外观与电气测试，验证焊点饱满与接触导通。
七 选型与采购建议
在选型时确认匹配的公端（排针）类型、插拔次数要求、表面处理与包装形式。若在高湿、高盐雾等特殊环境使用，可与供应商确认触点镀层和耐环境能力。XFCN（兴飞）系列产品通常提供批量供应与技术支持，采购前可索取样品进行功能与可靠性验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
