WMSIC Electronic Components

XFCN M2501VSF-04P M2501VSF

ModelM2501VSF-04P
PackageSMD,P=2.5mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179286

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M2501VSF-04P
Type
XFCN
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M2501VSF-04P
Electronic Component
1
Package
SMD,P=2.5mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.448g
Electronic Component
2.5mm
PIN
4P
Electronic Component
5
Electronic Component
BM0265820720
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Pin
1x4P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M2501VSF-04P线对板针座产品概述

一、产品定位与核心属性

M2501VSF-04P是兴飞(XFCN)品牌推出的1x4P单排立贴式线对板针座,专为中小功率电子设备的电路连接设计,采用SMD表面贴装工艺,引脚间距2.5mm,适配标准化线端连接器,兼顾安装效率与连接可靠性,是消费电子、小型工业控制等领域的通用连接组件。

二、关键参数与设计规格

该针座核心参数明确了应用边界与性能指标,核心参数如下:

  • 电气性能:额定电流3A(AC/DC通用)、额定电压250V,满足多数消费电子、小型工业设备的功率需求;触头接触电阻典型值≤10mΩ,信号传输损耗低;
  • 机械结构:单排4Pin设计,Z轴板上高度7.8mm、Y轴底边宽度8.4mm,结构紧凑,适配窄间距PCB布局;
  • 环境适应性:工作温度范围-25℃~+85℃,塑料材质选用LCP(液晶聚合物),兼具耐高温、耐化学腐蚀特性,阻燃等级达UL94V-0,符合电子设备安全规范。

三、结构设计与工艺优势

(一)立贴SMD安装

采用表面贴装(SMD)立贴结构,无需插件工序,可直接通过SMT自动化贴装线完成焊接,大幅提升生产效率;同时减少PCB钻孔需求,优化板卡空间利用。立贴设计使引脚垂直于PCB,适配线端连接器的垂直插拔,安装后连接方向清晰,便于布线与维护。

(二)精准间距与引脚设计

2.5mm标准化引脚间距,兼容市场主流2.5mm间距线端连接器(如端子线、IDC连接器等),无需额外定制适配,降低系统集成成本;4Pin单排布局对称,减少焊接时的桥接风险,焊接良率可达99%以上。

四、材料特性与可靠性保障

  • 触头系统:黄铜触头兼具良好导电性与机械强度,表面锡镀层可有效防止氧化,延长接触寿命(插拔次数≥500次),确保长期使用中连接稳定;
  • 绝缘壳体:LCP塑料壳体耐温性能优异(连续使用温度130℃+,短期耐温200℃+),匹配SMT回流焊工艺(峰值温度260℃/10s),不会出现变形或开裂;UL94V-0阻燃等级可在火灾场景下延缓燃烧,提升设备安全性;
  • 尺寸精度:关键尺寸(引脚间距、板上高度)公差控制在±0.1mm内,确保与线端连接器精准对接,减少插拔阻力与接触不良问题。

五、典型应用场景

M2501VSF-04P凭借紧凑结构、可靠性能与高适配性,广泛应用于以下领域:

  1. 消费电子:智能家居设备(智能灯、传感器模块)、小型家电(加湿器、蓝牙耳机充电盒)的内部电路连接;
  2. 工业控制:小型PLC模块、传感器节点、微型电机控制器的信号/电源传输;
  3. 通信设备:低功率无线模块(BLE、WiFi模块)、小型基站配件的接口连接;
  4. 汽车电子:车载小功率辅助设备(氛围灯、胎压监测传感器)的内部连接(需结合整车环境验证)。

六、总结

M2501VSF-04P作为兴飞品牌的经典2.5mm间距立贴针座,以高适配性、高可靠性、高生产效率为核心优势,平衡了电气性能、机械结构与成本控制,是中小功率电子设备电路连接的优选组件,可满足多数常规应用场景的连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.