WMSIC Electronic Components

XFCN M3965V-09P M3965V

ModelM3965V-09P
PackageP=3.96mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179290

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M3965V-09P
Type
XFCN
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M3965V-09P
Electronic Component
1
Package
P=3.96mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
3.03g
Electronic Component
3.96mm
PIN
9P
Electronic Component
1
Electronic Component
BM0265157320
Electronic Component
PA66
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃
Pin
1x9P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XFCN兴飞M3965V-09P 1x9P直插排针产品概述

XFCN(兴飞)M3965V-09P是一款针对小功率信号与电源传输设计的1排9针直插排针,采用3.96mm中心间距,平衡了电路密度与加工适配性,广泛适用于工业控制、消费电子等领域的紧凑布局需求。

一、基础参数明细

1. 结构与尺寸参数

  • 插针结构:1排9针(1×9P)
  • 中心间距:3.96mm(封装代号P=3.96mm)
  • 安装方式:直插式
  • 板上尺寸:Z轴(垂直PCB高度)10.78mm,Y轴(底边宽度)7.62mm
  • 总PIN数:9针,每排9针,排数1

2. 电气性能参数

  • 额定电流:5A/针(满足小功率电源与信号传输)
  • 额定电压:250V AC/DC
  • 接触电阻:典型值≤20mΩ(低电阻设计保障信号完整性)

3. 材料与防护参数

  • 触头材质:黄铜(高导电率,降低传输损耗)
  • 触头镀层:锡(抗氧化、增强接触稳定性)
  • 塑料壳体:PA66(尼龙66,耐温性与机械强度优异)
  • 阻燃等级:UL94V-0(符合严格安全阻燃标准)

二、核心性能优势

1. 电气可靠性稳定

黄铜触头结合锡镀层,有效抑制接触氧化与电阻升高,在5A额定电流下可稳定传输12V/24V小功率电源及数字信号,避免信号衰减或电压降问题,适配多数常规电路需求。

2. 环境适应性强

  • 工作温度范围:-25℃~+85℃,覆盖工业级设备(如车间控制柜)与民用级设备(如智能家居)的典型环境温度;
  • PA66壳体耐冲击、耐湿热,UL94V-0阻燃等级可降低设备起火风险,适合对安全要求较高的场景。

3. 安装适配性友好

直插式设计无需特殊工具,可通过常规波峰焊或手工焊接安装,适配大多数PCB板的焊盘布局;3.96mm间距平衡了电路密度与焊接难度,避免相邻针脚短路风险,降低生产良率损耗。

三、典型应用场景

M3965V-09P因紧凑尺寸与稳定性能,适用于以下场景:

  1. 工业自动化:PLC控制器、传感器模块、小型伺服驱动器的信号/电源接口;
  2. 消费电子:智能家居网关、小型家电控制板、便携式电子设备的内部连接;
  3. 通信终端:路由器、交换机的辅助接口模块;
  4. 医疗器械:低功率监护设备、小型诊断仪器的内部电路连接(非高压/高电流部分)。

四、安装注意事项

  1. 焊接温度:推荐焊接温度≤260℃(持续时间≤3秒),避免PA66壳体因高温变形;
  2. 安装方向:确保直插针垂直插入PCB焊盘,避免PIN弯曲导致接触不良;
  3. 清洁处理:焊接后可通过常规酒精清洁去除助焊剂残留,不影响性能。

该产品兼顾性能与成本,是中小功率电路连接的高性价比选择,可满足多数常规设备的内部信号与电源传输需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.