WMSIC Electronic Components

Silergy SY8113B1ADC

ModelSY8113B1ADC
PackageTSOT23-6
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY8113B1ADC
Type
SILERGY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8113B1ADC
Electronic Component
1
Package
TSOT23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.037g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0211497619
Operating Voltage
4.2V~18V
Switching Frequency
1.4MHz
Electronic Component
Electronic Component
Output Current
3A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY8113B1ADC 产品概述

一、简介

SY8113B1ADC 是硅力杰(silergy)推出的一款高效同步降压型开关稳压器,工作电压范围宽(4.2V~18V),支持最高3A输出电流,开关频率为1.4MHz,内置高侧/低侧开关管,并提供可调输出。器件采用小型 TSOT23-6 封装,针对对尺寸、效率和稳压精度有较高要求的便携与嵌入式系统设计而优化。

该器件适合以电池或单节锂电(4.2V)为输入,或在更高电压总线上(最高18V)降压到系统所需电压,兼顾效率与电磁兼容性(EMI)设计。1.4MHz 的工作频率有利于减小外部电感与电容体积,从而实现更紧凑的电源解决方案。

二、主要特点

  • 输入电压范围:4.2V 至 18V,兼容单节锂电与更高电压供电场景。
  • 输出能力:持续 3A 输出电流,适用于中等负载的点对点供电。
  • 同步整流:内部集成同步整流 MOSFET,提高转换效率并降低功耗。
  • 开关频率:典型 1.4MHz,允许使用小型电感与电容,缩小 PCB 面积。
  • 输出类型:可调输出,方便满足各种电压轨设计需求。
  • 封装:TSOT23-6,小体积便于空间受限的系统布局。
  • 高效率:在常见输出电压与负载范围内实现高转换效率,延长电池续航与降低发热。

三、适用场景

  • 消费类便携设备:便携式音频、蓝牙设备、手持测量仪器等需要小体积、高效率电源的产品。
  • 电池供电系统:单节锂电到系统电压的稳压转换,包含充放电管理前后的稳压需求。
  • 工业与汽车电子(低压侧):在汽车或工业控制模块中将较高电压降至 MCU 或外围芯片所需电平(需确认瞬态与耐压要求)。
  • 通信与网络终端:为无线模块、传感器和外围驱动电路提供稳定电源。

四、典型电路与设计要点

  • 外围元件选型:由于开关频率高,建议选用低 DCR 的功率电感和低 ESR 的输出电容(陶瓷电容优先),以降低纹波并提升瞬态响应。
  • 输入滤波:在 VIN 与 GND 之间靠近器件放置输入去耦电容,抑制输入纹波与尖峰电压。
  • 布局要求:开关节点(SW)、电感与二极管/电容应尽量短且紧凑布置,减少环路面积,有助于降低电磁干扰和提升热性能。
  • 热管理:TSOT23-6 封装热阻相对较大,应关注器件附近的铜箔面积以增强散热,必要时在 PCB 底层布置散热平面或通过多层铜箔传导热量。
  • 启动与稳定:为确保稳定启动与短路保护响应,建议按照器件数据手册推荐的软启动、补偿网络和反馈分压进行设计调校。

五、封装与热管理

TSOT23-6 小封装适合对空间敏感的应用,但散热能力有限。设计时建议:

  • 在 PCB 布局中为 VIN、GND 和 SW 增加铜面积以帮助散热;
  • 采用多层 PCB 时,将内层或底层作为散热平面连接器件地,提高热扩散效率;
  • 评估在最大输出电流与输入电压下的功耗与结温,必要时限制持续输出或增加外部散热措施。

六、选型建议与注意事项

  • 确认最大输入电压与瞬态耐压满足系统需求(18V 是典型上限,若存在高压瞬态需额外保护);
  • 根据输出电流与允许温升选择适当电感规格和 PCB 散热设计;
  • 根据系统对启动、欠压及短路保护的具体要求,检查器件数据手册中的保护与工作模式说明(软启动、过流/过温保护等);
  • 若对 EMI 有严格要求,可在器件周围增加滤波与屏蔽设计,同时优化开关节点走线以降低辐射。

总结:SY8113B1ADC 以其宽输入电压、高达 3A 的输出能力、内置同步整流和 1.4MHz 的高开关频率,为追求小型化、高效率的降压电源设计提供了灵活可靠的解决方案。实际使用时应结合数据手册中给出的原理图与布线建议,合理选型外围元件与散热措施,以确保在目标工况下实现稳定、可靠的电源输出。

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