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Silergy SY6818PLC
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- silergy SY6818PLC
- Type
- SILERGY
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SILERGY
- Electronic Component
- SY6818PLC
- Electronic Component
- 1
- Package
- CSP-12(1.7x1.7)
- Type
- Load Switch
- Electronic Component
- Power Electronic Switch
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Current
- Electronic Component
- BM0229970778
- Resistor
- 53mΩ
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.5V~30V
- Current
- 3A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SY6818PLC 产品概述
一、产品简介
SY6818PLC 是矽力杰（silergy）推出的一款单通道负载开关，专为 USB 供电和便携式设备电源管理设计。器件采用小尺寸 CSP-12（1.7 × 1.7 mm）封装，输入控制逻辑为高电平有效，能在 2.5V 至 30V 的宽电压范围内稳定工作，适合多种电源轨的开关控制与保护应用。
二、主要电气参数
- 类型：单通道负载开关
- 最大连续电流：3 A
- 导通电阻（RDS(on)）：53 mΩ
- 工作电压范围：2.5 V ~ 30 V
- 控制逻辑：高电平使能（ENABLE 高电平导通）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 保护功能：过热保护（OTP）、过流保护（OCP）、过压保护（OVP）
注：在满载 3 A 时，理论压降约为 0.159 V（V = I·R），功耗约 0.477 W（P = I^2·R），需做好热管理与 PCB 散热设计。
三、封装与热管理
SY6818PLC 的 CSP-12 1.7×1.7 mm 超小封装适合空间受限的移动设备和消费类电子。由于内部导通电阻导致的功耗在高电流下不容忽视，建议在 PCB 设计中：
- 在器件底部或附近设计热铜箔与散热大面积，增加散热面积；
- 利用若干热通孔（thermal vias）连通底层散热平面；
- 在输入与输出引脚附近放置合适的旁路电容以降低瞬态应力。
四、典型应用场景
- USB 供电开关（上游/下游电源控制与过流保护）
- 手机、平板和可穿戴设备的外设电源管理
- 电源分配开关与热插拔保护
- 车载与工业便携设备的负载控制
五、设计与布局要点
- 输入输出端均推荐使用低 ESR 陶瓷电容（常见 1 μF–10 μF）靠近器件引脚，以抑制瞬态电压波动；
- ENABLE 控制信号应与 MCU 或电源管理控制器逻辑电平兼容，若控制端与主供电不同电位，注意信号电平转换或加上上拉电阻；
- 考虑器件在高温和满载工况下的热降额，对板级功率路径进行评估；
- 在设计时应留出足够的 PCB 铜面积和过孔以帮助散热，并避免较长而狭窄的走线影响电阻和热量积累。
六、可靠性与测试建议
- 验证 OCP/OTP/OVP 在目标负载和环境温度下的动作表现，确保系统在短路或过载情况下安全限流与自恢复；
- 进行典型的热板测试与功耗测量，确认在最差工况下器件结温（Tj）在允许范围内；
- 对于车规或工业级应用，务必参照完整数据手册执行额定温漂、机械应力与湿热测试。
如需详细引脚定义、时序图、典型应用电路及更精确的热阻与限流特性，请参考矽力杰 SY6818PLC 的正式数据手册。
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