WMSIC Electronic Components

Silergy SY8063DBC

ModelSY8063DBC
PackageDFN-10-EP(3x3)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY8063DBC
Type
SILERGY
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8063DBC
Electronic Component
1
Package
DFN-10-EP(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.057g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230030229
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.7V~5.5V
Switching Frequency
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY8063DBC 产品概述

一、产品概述

SY8063DBC 是硅力杰(silergy)推出的一款高集成降压型 DC-DC 转换器,采用同步整流、内置功率开关的单通道降压拓扑,输入电压范围宽(2.7V~5.5V),最大输出电流可达 3.5A。器件工作频率高达 1MHz,静态电流仅 80µA,适合对效率、体积与功耗有综合要求的便携与嵌入式电源设计。封装为 DFN-10-EP(3x3),带大热焊盘,利于散热与布局。

二、主要特性

  • 输入电压:2.7V ~ 5.5V
  • 输出电流:最高 3.5A(持续)
  • 开关频率:典型 1MHz,便于使用小体积电感与陶瓷电容
  • 同步整流:支持,高效率、无需外接整流二极管
  • 静态电流:典型 80µA,适合电池供电系统
  • 输出类型:可调输出,外接电阻可设定目标电压
  • 温度范围:-40°C ~ +85°C(TA)
  • 封装:DFN-10-EP (3x3),带热沉焊盘

三、电气与性能要点

SY8063DBC 在轻载与重载区间均能保持较高效率,1MHz 的工作频率允许使用 1.0µH~2.2µH 的电感以在体积和纹波之间取得平衡。器件集成开关管减小外部元器件数量,但在高电流工作时需关注封装热阻与PCB散热设计。内部通常包含过流保护、热关断与欠压锁定等保护机制,增强系统可靠性。

四、外部元件推荐与布局要点

  • 输入电容:建议 10µF~47µF X5R/X7R 多层陶瓷,靠近 VIN 与 GND 引脚布局以抑制输入纹波。
  • 输出电容:建议 22µF~100µF 陶瓷,低 ESR 有利于稳定环路与降低输出纹波。
  • 电感:1.0µH~2.2µH,饱和电流大于 3.5A,尽量选择 DCR 低的型号以提高效率。
  • 布局建议:将输入电容、器件和电感构成最短回路;SW 节点走线尽量短且避开敏感模拟线路;充分利用封装底部热焊盘并通过多孔过孔连接至内层/底层大面积铜箔以增强散热。

五、保护与热管理

SY8063DBC 内置常见保护功能(如过流保护、热关断、欠压锁定),在异常条件下可保护芯片与负载。对于持续大电流应用,应予以充分的 PCB 散热设计:扩大地铜面积、增加底部焊盘过孔并靠近散热层布线,以降低结壳温升并提升可靠性。

六、典型应用

  • 手持设备与移动电源管理
  • 电池供电的物联网与可穿戴设备
  • 嵌入式系统、单板计算与工业控制电源
  • 消费类电子(摄像机、蓝牙音箱等)

总结:SY8063DBC 以高频、低静耗与高集成度为设计亮点,适合在空间受限且对效率、功耗敏感的电源设计中使用。合理选择外部电感与陶瓷电容并优化 PCB 散热与走线,可发挥该芯片的最佳性能。若需具体应用电路与参数调优建议,可提供目标 Vin/Vout 与负载条件以便进一步给出参考值与仿真建议。

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