WMSIC Electronic Components

XUNPU WAFER-MX1.25-2PZZ

ModelWAFER-MX1.25-2PZZ
PackageThrough-hole, P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-MX1.25-2PZZ
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-MX1.25-2PZZ
Electronic Component
1
Package
Through-hole, P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.075g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
PicoBlade(MX 1.25)
Electronic Component
BM0265723307
Electronic Component
LCP
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-MX1.25-2PZZ 线对板针座产品概述

一、产品基本定位与核心规格

WAFER-MX1.25-2PZZ是讯普(XUNPU)品牌推出的线对板直插式针座,属于1.25mm间距系列产品,参考行业经典的PicoBlade(MX 1.25)系列设计,核心定位为小型化电子设备的信号与小功率电源传输接口。该产品采用1排2针(1×2P)插针结构,总PIN数为2P,是针对轻量化、高密度接口场景开发的基础连接器组件,适配对尺寸敏感的电子设备需求。

二、关键性能参数详解

1. 电气性能

  • 额定电流:1A(满足小功率信号传输及低功耗设备电源供应,如穿戴设备、传感器模块);
  • 额定电压:125V(符合低压电子设备安全标准,避免高压击穿风险);
  • 工作温度:-25℃~+85℃(覆盖常规室内、户外及车载环境,适配多场景应用)。

2. 结构尺寸

采用紧凑化设计,板上安装后关键尺寸:

  • Z轴高度:4.6mm(不占用过多垂直空间,适配超薄设备);
  • X轴底边长度:4.4mm(沿插针间距方向,缩短横向布局长度);
  • Y轴底边宽度:3.3mm(垂直间距方向,优化PCB空间利用率)。

三、材料与工艺特性

1. 触头部分

  • 基材:黄铜(兼具优异导电性与机械强度,确保电流传输稳定,不易因振动导致接触不良);
  • 镀层:锡(提升抗氧化能力,避免触头氧化影响接触电阻,同时与PCB焊盘兼容性强,焊接可靠性高)。

2. 塑料主体

  • 材质:LCP(液晶聚合物)(耐高温、尺寸稳定性优异,长期使用不易变形,适配焊接高温环境);
  • 阻燃等级:UL94V-0(最高阻燃等级之一,可有效抑制火焰蔓延,降低电子设备火灾风险);
  • 外观:米色(便于生产过程中识别、检测,提升组装效率)。

四、安装方式与适配兼容性

该产品采用直插式(插件) 安装方式,无需特殊工装,可通过传统波峰焊或手工焊接实现与PCB的固定连接,安装便捷且成本可控。

由于参考PicoBlade(MX 1.25)系列设计,可与同系列的线端连接器(如讯普同系列端子、护套)完美适配,实现线对板的可靠连接,提升产品组合的通用性,降低客户选型与替换成本。

五、典型应用场景

WAFER-MX1.25-2PZZ因紧凑尺寸、可靠性能与宽温适配性,广泛应用于以下领域:

  1. 消费电子:TWS蓝牙耳机充电盒的电池接口、智能手环/手表的传感器连接、小型蓝牙音箱的电源/信号传输;
  2. 智能家居:智能门锁的指纹传感器接口、温湿度传感器模块的信号输出、小型智能开关的控制接口;
  3. 汽车电子:车载小型传感器(如胎压监测辅助模块、车内氛围灯控制器)的接口;
  4. 工业控制:小型PLC的输入输出接口、工业传感器(如光电传感器)的信号连接。

六、产品核心优势总结

  1. 紧凑高密度:1.25mm小间距+迷你尺寸,适配小型化PCB布局,满足电子设备轻量化趋势;
  2. 可靠稳定:黄铜触头+锡镀层,导电性能优异,焊接可靠性高,长期使用不易接触不良;
  3. 安全耐用:LCP材料耐温、UL94V-0阻燃,宽温范围适应复杂环境,提升产品寿命;
  4. 兼容通用:参考PicoBlade系列,可与同系列线端连接器无缝配合,降低选型成本;
  5. 安装便捷:直插式设计,兼容传统焊接工艺,生产效率高,适合批量制造。

该产品凭借平衡的性能与成本优势,成为小型电子设备接口设计的优选组件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.