Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-SH1.0-5PWB是讯普(XUNPU)推出的1mm间距卧贴式线对板针座,专为小型化电子设备的信号/低功率传输设计。核心参数明确:
采用1mm标准间距,相比常规2.0mm间距产品体积缩小近50%,可有效降低PCB板的占用空间,满足智能穿戴、小型传感器等轻薄化设备的设计需求。板上尺寸(7.35×4.3×3.15mm)适配常规SMD贴装设备,无需特殊治具。
产品新增辅助焊脚设计,焊接时可与PCB板额外固定,不仅分散信号脚的焊接应力,还能大幅提升抗振性能——经测试,振动环境下(10~2000Hz,1G加速度)的连接可靠性较无辅助焊脚产品提升30%以上,适合工业控制、车载电子等有振动的场景。
工作温度范围-40℃+85℃,可适应低温(如北方户外设备)、高温(如车载中控舱内)场景,无需额外加防护措施;存储温度建议-20℃+60℃,避免潮湿环境导致触头氧化。
辅助焊脚+LCP塑料的组合,使产品可承受100m/s²(10G)的冲击测试(11ms半正弦波),连接状态无松动,适合手持设备、工业机器人等易受冲击的场景。
WAFER-SH1.0-5PWB凭借紧凑体积、可靠性能及宽环境适配性,成为小型电子设备线对板连接的高性价比选择,尤其适合对空间和可靠性有双重要求的场景。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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