WMSIC Electronic Components

XUNPU WAFER-SH1.0-5PWB

ModelWAFER-SH1.0-5PWB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-5PWB
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-5PWB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.24g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
5P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0265723306
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-SH1.0-5PWB线对板针座产品概述

一、产品基本定位与核心参数

WAFER-SH1.0-5PWB是讯普(XUNPU)推出的1mm间距卧贴式线对板针座,专为小型化电子设备的信号/低功率传输设计。核心参数明确:

  • 插针结构:1排5针(1×5P),总PIN数5;
  • 安装方式:SMD卧贴(表面贴装),适配PCB板高密度布局;
  • 基础尺寸:板上Z轴高度3.15mm、X轴底边长度7.35mm、Y轴宽度4.3mm,体积紧凑;
  • 附加特征:带辅助焊脚,提升焊接可靠性。

二、关键结构设计特点

1. 窄间距紧凑结构

采用1mm标准间距,相比常规2.0mm间距产品体积缩小近50%,可有效降低PCB板的占用空间,满足智能穿戴、小型传感器等轻薄化设备的设计需求。板上尺寸(7.35×4.3×3.15mm)适配常规SMD贴装设备,无需特殊治具。

2. 辅助焊脚增强可靠性

产品新增辅助焊脚设计,焊接时可与PCB板额外固定,不仅分散信号脚的焊接应力,还能大幅提升抗振性能——经测试,振动环境下(10~2000Hz,1G加速度)的连接可靠性较无辅助焊脚产品提升30%以上,适合工业控制、车载电子等有振动的场景。

3. 优质材料适配多场景

  • 触头部分:黄铜基底+锡镀层,导电性能稳定(接触电阻≤20mΩ),锡镀层可有效防止氧化,延长使用寿命;
  • 塑料主体:LCP(液晶聚合物)材质,耐温范围宽(-40℃~+85℃),机械强度高,可承受回流焊高温(峰值245℃),且不易变形。

三、电气性能与安全指标

  • 额定电流:1A/针,满足大多数小型电子设备的信号传输(如传感器模拟信号、数字通信)及低功率供电(如智能手环充电)需求;
  • 额定电压:50V AC/DC,覆盖常规低压电路的安全范围,符合GB/T 4943.1等电子设备安全标准;
  • 绝缘电阻:≥1000MΩ(常温下),防止信号串扰,确保传输稳定性。

四、环境适应性与可靠性

1. 宽温环境兼容

工作温度范围-40℃+85℃,可适应低温(如北方户外设备)、高温(如车载中控舱内)场景,无需额外加防护措施;存储温度建议-20℃+60℃,避免潮湿环境导致触头氧化。

2. 抗振抗冲击性能

辅助焊脚+LCP塑料的组合,使产品可承受100m/s²(10G)的冲击测试(11ms半正弦波),连接状态无松动,适合手持设备、工业机器人等易受冲击的场景。

五、典型应用场景

  1. 智能穿戴设备:智能手环、蓝牙耳机充电座的主体与充电触点连接,适配轻薄化设计;
  2. 小型工业传感器:温度、压力传感器的信号输出接口,稳定传输模拟信号;
  3. 通信设备配件:路由器、光猫的小型扩展接口(如状态指示灯、复位键连接);
  4. 车载电子周边:车内氛围灯、小型控制器的板端连接,适应车载振动环境。

六、安装与使用注意事项

  1. 焊接工艺:采用无铅回流焊,峰值温度控制在240~245℃(保持时间≤10s),避免LCP塑料变形;
  2. 辅助焊脚焊接:需确保辅助焊脚与PCB焊盘完全焊接,不可仅焊接信号脚(易导致振动脱落);
  3. 配对要求:需匹配讯普SH系列1mm间距的线端连接器(如SH1.0-5P端子线),确保插针与端子的接触精度;
  4. 存储与运输:避免与腐蚀性气体接触,运输时采用防静电包装,防止触头污染。

WAFER-SH1.0-5PWB凭借紧凑体积、可靠性能及宽环境适配性,成为小型电子设备线对板连接的高性价比选择,尤其适合对空间和可靠性有双重要求的场景。

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