WMSIC Electronic Components

XUNPU WAFER-PH2.0-4PWZ

ModelWAFER-PH2.0-4PWZ
PackageP=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-4PWZ
Type
XUNPU
Minimum package
1000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-4PWZ
Electronic Component
1
Package
P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.46g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0265062296
Electronic Component
PA66
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-4PWZ 线对板针座产品概述

WAFER-PH2.0-4PWZ是讯普(XUNPU)推出的1×4P弯插式线对板针座,适配PH2.0mm标准间距端子,专为小型电子设备的电路连接设计,兼具稳定导电性能与可靠机械强度,满足多场景下的低功率信号/电源传输需求。

一、产品基础定位与核心特征

作为PH系列线对板连接组件的一员,本产品核心定位为小间距、多用途的板端连接器件,核心特征包括:

  • 采用1排4针布局,适配4芯PH端子线;
  • 弯插式安装(Z轴板上高度仅4.7mm),节省PCB板垂直空间;
  • 符合UL94V-0阻燃等级,安全可靠;
  • 黄铜触头+锡镀层,导电性能稳定且防氧化。

二、关键性能参数详解

1. 电气性能

  • 额定电流:2A(AC/DC通用,满足小功率设备供电需求);
  • 额定电压:250V(AC/DC,适配常规低压电路);
  • 接触电阻:锡镀层触头可保证低接触电阻(通常≤20mΩ),长期使用无明显衰减。

2. 环境适应性

  • 工作温度范围:-25℃~+85℃,覆盖常规室内/户外(低温环境需评估)使用场景;
  • 阻燃等级:UL94V-0(塑料部分采用PA66材质,遇火自熄,提升设备安全性);
  • 耐腐蚀性:锡镀层触头可抵抗轻度潮湿、盐雾环境(需避免长期浸泡)。

3. 尺寸规格

  • 间距:2.0mm(PH系列标准间距,兼容性强);
  • 板上尺寸:
    • Z轴(垂直高度):4.7mm;
    • X轴(底边长度,间距线方向):10mm(4针×2mm间距+两端余量);
    • Y轴(底边宽度):6.05mm;
  • 总PIN数:4P,1排布局。

三、结构与材质特性

1. 插针结构设计

  • 弯插式设计:插针90°弯折,可实现PCB板侧面/端面安装,有效节省垂直方向空间,适合小型化设备(如手持仪器、微型家电);
  • 定位结构:塑料基座带定位柱,安装时可精准对齐PCB开孔,避免偏移,提升焊接效率。

2. 触头材质

  • 基础材质:黄铜(H65牌号),导电率高、机械强度适中;
  • 表面镀层:锡(Sn),厚度≥5μm,优势为:
    • 焊接性能优异,适配常规电烙铁/波峰焊;
    • 防氧化能力强,长期使用接触电阻稳定;
    • 成本低于金/银镀层,性价比高。

3. 塑料基座材质

  • 主体:PA66(聚酰胺66),特点为:
    • 耐温性好(长期使用温度≤100℃,符合产品工作范围);
    • 机械强度高,抗冲击、抗弯折;
    • 颜色:白色,便于生产过程中识别与质检。

四、典型应用场景

本产品因小间距、低功耗、高可靠性,广泛应用于以下领域:

  1. 小型家电:电饭煲、加湿器、电热水壶等的控制板与电源/传感器连接;
  2. 智能家居:智能开关、温湿度传感器、智能门锁的内部电路连接;
  3. 小型电子仪器:万用表、信号发生器、便携式测试设备的板端连接;
  4. 汽车电子:车载小功率模块(如氛围灯控制器、USB充电模块)的内部连接;
  5. 消费电子:耳机充电盒、小型蓝牙音箱的电路连接。

五、安装与使用注意事项

  1. PCB板匹配:需确认PCB板开孔间距为2.0mm,孔径适配弯插针脚尺寸(通常0.8-1.0mm);
  2. 焊接要求:
    • 电烙铁温度:260℃±10℃,焊接时间≤2秒/针(避免高温损坏塑料基座);
    • 波峰焊:温度240℃-250℃,时间≤3秒(需符合波峰焊工艺规范);
  3. 使用环境:避免在-25℃以下或+85℃以上环境长期使用,远离强酸、强碱等腐蚀性气体;
  4. 端子匹配:需使用对应PH2.0mm间距的4芯端子线(如PH-4P端子),确保插合紧密,无松动;
  5. 机械防护:安装后避免对针座施加过大拉力或冲击力,防止插针弯折或基座开裂。

本产品可满足多场景下的小间距电路连接需求,兼具性价比与可靠性,是小型电子设备连接方案的优选组件。

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