WMSIC Electronic Components

XUNPU WAFER-PH2.0-4PLB

ModelWAFER-PH2.0-4PLB
PackageSMD,P=2.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-4PLB
Type
XUNPU
Minimum package
700

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-4PLB
Electronic Component
1
Package
SMD,P=2.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.87g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0265583440
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-4PLB线对板针座产品概述

一、核心定位与基础规格梳理

WAFER-PH2.0-4PLB是讯普(XUNPU)PH系列下的单排4Pin线对板针座,专为小型化电子设备的信号/电力传输设计,兼顾紧凑性与可靠性。产品基础规格明确:

  • 插针结构:1×4P(单排4针),总Pin数4,排数1,每排4Pin;
  • 间距:2.0mm(行业常用紧凑间距,适配高密度PCB布局);
  • 安装方式:立贴式SMD(表面贴装,支持自动化SMT生产);
  • 附加特征:内置辅助焊脚(增强焊接稳定性);
  • 外观与尺寸:米色LCP塑料主体,板上安装后Z轴(垂直PCB)高度6.2mm,X轴(沿间距方向底边长度)12mm,Y轴(垂直间距方向底边宽度)5.45mm,整体尺寸紧凑。

该型号属于PH系列通用规格,与同间距PH端子线完全兼容,是跨领域设备的常用连接组件。

二、结构设计与材质特性解析

产品的结构和材质围绕可靠性、加工性、环境适应性三大核心优化:

触头部分

采用黄铜基底+锡镀层:黄铜具有优异的导电性与机械强度,锡镀层则显著提升焊接性(降低虚焊风险)、抗氧化性(延长使用寿命),同时符合RoHS环保要求。单Pin额定电流2A,满足一般低至中等负载的电力传输需求(如小型电机、传感器供电)。

塑料主体

选用LCP(液晶聚合物):LCP材质具备三大优势——① 耐高温性:长期工作温度覆盖-25℃~+85℃,适配家电夏季高温、工业模块低温存储等场景;② 尺寸稳定性:高温下不易变形,保证引脚间距精度;③ 耐化学性:抗常见溶剂腐蚀,延长产品寿命。米色外观便于生产过程中的视觉识别。

辅助焊脚设计

额外增加的辅助焊脚可分散焊接应力,避免设备振动(如小型家电运输、工业设备运行)导致的针座脱落或虚焊,大幅提升长期使用可靠性。

三、电气性能参数详解

WAFER-PH2.0-4PLB的电气性能稳定可靠,关键参数覆盖主流应用场景:

  • 额定电流:2A/单Pin(总电流可根据负载均衡设计,满足多数小型设备供电需求);
  • 额定电压:250V AC/DC(符合低压电力传输安全标准,避免过压风险);
  • 工作温度范围:-25℃~+85℃(覆盖家用、工业、消费电子的常见环境温度);
  • 绝缘性能:LCP塑料主体保证引脚间绝缘性,避免短路风险。

这些参数无需额外升级更高规格组件,即可满足绝大多数小型电子设备的连接需求。

四、安装适配与典型应用场景

安装适配性

立贴式SMD封装支持自动化贴装(SMT产线),生产效率高;辅助焊脚配合主引脚焊接,焊接点牢固,适配常规1.6mm及以下厚度PCB。2.0mm间距设计兼容同系列端子线(如PH-4P端子),连接操作简便,无需特殊工具。

典型应用场景

产品因紧凑尺寸、稳定性能,广泛应用于:

  1. 小型家电:豆浆机、加湿器、电热水壶的控制板连接(传输传感器信号、电机供电);
  2. 智能家居:智能开关、温湿度传感器、智能门锁的模块连接;
  3. 工业控制小模块:PLC扩展IO口、小型光电传感器的接口;
  4. 消费电子:蓝牙耳机充电盒、智能手环主板、便携式音箱的内部连接。

五、产品核心优势总结

相比同类竞品,WAFER-PH2.0-4PLB具备以下突出优势:

  1. 紧凑尺寸:2mm间距比2.54mm间距节省约21%PCB空间,适配小型化设备趋势;
  2. 高可靠性:辅助焊脚+LCP材质+锡镀层触头,抗振动、耐高温、抗氧化;
  3. 易加工性:SMD立贴适配自动化生产,降低人工成本与焊接误差;
  4. 通用兼容性:PH系列通用规格,与同间距端子线无缝对接,替换成本低;
  5. 性价比高:讯普品牌保证品质一致性,成本控制合理,适合批量应用。

综上,WAFER-PH2.0-4PLB是一款高性价比、稳定可靠的线对板针座,可满足多领域小型电子设备的连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.