Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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WAFER-PH2.0-4PLB是讯普(XUNPU)PH系列下的单排4Pin线对板针座,专为小型化电子设备的信号/电力传输设计,兼顾紧凑性与可靠性。产品基础规格明确:
该型号属于PH系列通用规格,与同间距PH端子线完全兼容,是跨领域设备的常用连接组件。
产品的结构和材质围绕可靠性、加工性、环境适应性三大核心优化:
采用黄铜基底+锡镀层:黄铜具有优异的导电性与机械强度,锡镀层则显著提升焊接性(降低虚焊风险)、抗氧化性(延长使用寿命),同时符合RoHS环保要求。单Pin额定电流2A,满足一般低至中等负载的电力传输需求(如小型电机、传感器供电)。
选用LCP(液晶聚合物):LCP材质具备三大优势——① 耐高温性:长期工作温度覆盖-25℃~+85℃,适配家电夏季高温、工业模块低温存储等场景;② 尺寸稳定性:高温下不易变形,保证引脚间距精度;③ 耐化学性:抗常见溶剂腐蚀,延长产品寿命。米色外观便于生产过程中的视觉识别。
额外增加的辅助焊脚可分散焊接应力,避免设备振动(如小型家电运输、工业设备运行)导致的针座脱落或虚焊,大幅提升长期使用可靠性。
WAFER-PH2.0-4PLB的电气性能稳定可靠,关键参数覆盖主流应用场景:
这些参数无需额外升级更高规格组件,即可满足绝大多数小型电子设备的连接需求。
立贴式SMD封装支持自动化贴装(SMT产线),生产效率高;辅助焊脚配合主引脚焊接,焊接点牢固,适配常规1.6mm及以下厚度PCB。2.0mm间距设计兼容同系列端子线(如PH-4P端子),连接操作简便,无需特殊工具。
产品因紧凑尺寸、稳定性能,广泛应用于:
相比同类竞品,WAFER-PH2.0-4PLB具备以下突出优势:
综上,WAFER-PH2.0-4PLB是一款高性价比、稳定可靠的线对板针座,可满足多领域小型电子设备的连接需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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