WMSIC Electronic Components

XUNPU WAFER-PH2.0-2PWZ

ModelWAFER-PH2.0-2PWZ
PackageP=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-2PWZ
Type
XUNPU
Minimum package
2000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-2PWZ
Electronic Component
1
Package
P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.14g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0265062305
Electronic Component
PA66
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-2PWZ 线对板针座产品概述

一、产品核心定位与应用场景

WAFER-PH2.0-2PWZ是讯普(XUNPU)PH系列中的一款紧凑型线对板针座,采用1×2P(单排2针)弯插结构,间距2.0mm,专为小型化电子设备的可靠电路连接设计。其核心定位是满足低至中等功率(2A/250V) 设备的信号/电源传输需求,广泛覆盖以下场景:

  • 消费电子:小型家电(如智能加湿器、迷你音箱)、智能穿戴(手环/手表内部模块)、便携式设备的内部线板连接;
  • 智能家居:智能开关、温湿度传感器、小型控制器的信号传输;
  • 工业控制:微型PLC、传感器节点、小型执行器的低功率电路连接;
  • 汽车电子:车载辅助设备(氛围灯、胎压传感器模块)的内部连接(适配常规车载环境温度范围)。

二、关键技术参数

本产品参数严格遵循行业标准,核心性能如下:

1. 电气性能

  • 额定电流:2A(AC/DC通用,满足多数小型设备功率需求);
  • 额定电压:250V(AC/DC,符合低压电气安全规范);
  • 接触可靠性:黄铜触头+锡镀层设计,接触电阻低(≤10mΩ),无明显压降。

2. 机械性能

  • 针座规格:1×2P(单排2针,总PIN数2);
  • 间距:2.0mm(PH系列标准间距,适配主流导线端子);
  • 安装方式:弯插(触头焊接后向PCB侧面弯折,节省Z轴空间);
  • 板上尺寸:Z轴高度4.7mm,X轴底边长度6mm,Y轴底边宽度6.05mm(适配小型PCB板密集布局)。

3. 环境适应性

  • 工作温度:-25℃~+85℃(覆盖室内外常规环境,部分工业场景适用);
  • 阻燃等级:UL94V-0(塑料壳体遇火自熄,符合安全认证要求)。

4. 材料规格

  • 触头:黄铜(高导电率+良好机械强度)+ 表面锡镀层(抗氧化、防腐蚀);
  • 塑料壳体:PA66(耐温、耐冲击、阻燃性优异);
  • 外观颜色:白色(便于安装识别,区分不同功能模块)。

三、结构设计与工艺优势

  1. 弯插结构适配小型化
    相比直插针座,弯插设计可减少设备内部Z轴方向占用空间(仅4.7mm高度),特别适合厚度受限的设备(如智能手环、微型控制器)。

  2. 紧凑间距提升布局效率
    2.0mm间距是小型连接器主流标准,1×2P配置下整体尺寸紧凑,可在PCB板上密集布局多个针座,满足多信号/通道连接需求。

  3. 可靠接触设计
    黄铜触头经锡镀层处理,既保证导电性能(黄铜导电率≈1.06×10⁷ S/m),又能防止氧化腐蚀;触头与塑料壳体固定牢固,避免松动导致接触不良。

  4. 阻燃安全保障
    PA66塑料壳体阻燃等级达UL94V-0,在电子设备中可有效降低火灾风险,符合UL、CE等安全认证潜在要求。

四、品牌与品质管控

讯普(XUNPU)作为专业电子连接器制造商,对本产品的品质管控贯穿全流程:

  • 原材料管控:触头选用优质黄铜,塑料壳体采用环保PA66(兼容RoHS/REACH标准);
  • 生产工艺:自动化生产确保触头间距精准(误差≤±0.05mm),镀层均匀(厚度符合行业标准);
  • 品质检测:每批次产品经过电气性能(接触电阻、绝缘电阻)、机械强度(插拔力、弯折寿命)、环境测试(高低温循环、湿热) 等多重检测,确保一致性;
  • 供货稳定性:完善的供应链体系可满足批量订单的稳定交付需求。

五、安装与使用注意事项

  1. 安装操作要点

    • 焊接前确认针座与PCB焊盘对齐,避免偏位;
    • 弯插触头焊接温度控制在260℃以下(单焊点焊接时间≤3秒),防止塑料壳体变形;
    • 安装后避免过度弯折触头,防止断裂或松动。
  2. 环境限制

    • 避免在超过+85℃或低于-25℃的环境中长时间使用;
    • 远离强酸、强碱等腐蚀性气体/液体,防止触头镀层损坏;
    • 避免直接暴露在高湿度(>95%RH)环境中,防止绝缘性能下降。
  3. 维护建议

    • 定期检查针座与导线端子的连接牢固性(插拔力需符合设计要求);
    • 若触头氧化,可用无水酒精清洁,避免尖锐工具刮擦镀层。

WAFER-PH2.0-2PWZ凭借紧凑结构、可靠性能与安全设计,成为小型电子设备线板连接的高性价比选择,可满足多数低功率场景的稳定传输需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.